1.7. Intel® Stratix® 10 Compact Thermal Model (CTM)
The Intel® Stratix® 10 FPGA thermal analysis requires the use of its CTMs in a Computational Fluid Dynamic (CFD) tool. The results of the CFD analysis are only valid to determine the core fabric power and IHS temperature. These values are used to determine the junction temperature of all the dies.
This methodology is used because the construction of the CTM does not capture the details of transceiver channel placements; therefore, it cannot be used to predict the correct junction temperature of a transceiver die. The transceiver junction temperature is calculated using the total power dissipation, IHS temperature and thermal resistance of each die which will be covered in later sections.
- Icepak* from ANSYS
- Flotherm* from Mentor Graphics
- 6SigmaET* from Future Facilities
- Thermal Analysis* from SolidWorks
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