Intel Agilex® 7 F-Series and I-Series FPGA Memory Subsystem IP User Guide

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ID 789389
Date 10/02/2023
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Document Table of Contents
Document Table of Contents x
1. About the Intel Agilex® 7 F-Series and I-Series FPGA Memory Subsystem IP 2. Introduction to Memory Subsystem IP 3. Memory Subsystem IP Architecture and Feature Description 4. Memory Subsystem Features 5. Memory Subsystem Interfaces and Signals 6. Memory Subsystem User Operations 7. Memory Subsystem Register Descriptions 8. Parameterizing the Memory Subsystem IP 9. Simulating Your Design 10. Document Revision History for Intel Agilex® 7 F-Series and I-Series FPGA Memory Subsystem IP User Guide
1. About the Intel Agilex® 7 F-Series and I-Series FPGA Memory Subsystem IP x
1.1. Release Information
2. Introduction to Memory Subsystem IP x
2.1. Memory Subsystem Features 2.2. Getting Started with the Memory Subsystem IP 2.3. Memory Subsystem Resource Utilization
3. Memory Subsystem IP Architecture and Feature Description x
3.1. Memory-Specific Adaptor 3.2. Memory Subsystem Lookup Core IPs
3.1. Memory-Specific Adaptor x
3.1.1. Memory Subsystem Functional Description
3.1.1. Memory Subsystem Functional Description x
3.1.1.1. Write Data Replication 3.1.1.2. Bank Spreading 3.1.1.3. Memory Subsystem IP Scheduler 3.1.1.4. Memory Subsystem Auto-Precharge
3.2. Memory Subsystem Lookup Core IPs x
3.2.1. Memory Subsystem BCAM 3.2.2. Memory Subsystem TCAM 3.2.3. Memory Subsystem Multi-Bin Lookup (MBL)
3.2.1. Memory Subsystem BCAM x
3.2.1.1. Memory Subsystem BCAM Operations
3.2.2. Memory Subsystem TCAM x
3.2.2.1. Memory Subsystem TCAM Core Table 3.2.2.2. Memory Subsystem TCAM Operations
3.2.3. Memory Subsystem Multi-Bin Lookup (MBL) x
3.2.3.1. Memory Subsystem Multi-Bin Lookup (MBL) Functional Description 3.2.3.2. Pointers 3.2.3.3. Memory Subsystem MBL Operations 3.2.3.4. Row Collisions 3.2.3.5. Signature Collisions 3.2.3.6. Optimization Features
4. Memory Subsystem Features x
4.1. Memory-Specific Adaptor 4.2. External Memory Interface 4.3. Lookup IPs
4.2. External Memory Interface x
4.2.1. External Memory Interfaces IP Parameters Tab 4.2.2. Memory Control and Diagnostics Tab
4.3. Lookup IPs x
4.3.1. TCAM 4.3.2. BCAM 4.3.3. MBL
5. Memory Subsystem Interfaces and Signals x
5.1. AXI Memory Mapped (AXI-MM) Interface 5.2. AXI-Lite Interface 5.3. Lookup IPs 5.4. Request/Acknowledge and Reset Signals 5.5. Clock Signals
5.3. Lookup IPs x
5.3.1. TCAM AXI-ST Request Interface 5.3.2. TCAM AXI-ST Response Interface 5.3.3. TCAM AXI-Lite Interface 5.3.4. BCAM AXI-ST Request Interface 5.3.5. BCAM AXI-ST Response Interface 5.3.6. BCAM AXI-Lite Interface 5.3.7. MBL AXI-ST Request Interface 5.3.8. MBL AXI-ST Response Interface 5.3.9. MBL AXI-Lite Interface
6. Memory Subsystem User Operations x
6.1. Memory Specific Adaptor 6.2. Performing TCAM Operations 6.3. Performing BCAM Operations 6.4. Performing MBL Operations
6.2. Performing TCAM Operations x
6.2.1. TCAM Flush Operations 6.2.2. TCAM Insert Operations 6.2.3. TCAM Delete by Entry ID Operations 6.2.4. TCAM Delete by Key Operations 6.2.5. TCAM Lookup Operations through the AXI-Lite Interface 6.2.6. TCAM Lookup Operations through the AXI-ST Interface
6.3. Performing BCAM Operations x
6.3.1. BCAM Flush Operations 6.3.2. BCAM Insert Operations 6.3.3. BCAM Modify Operations 6.3.4. BCAM Delete Operations 6.3.5. BCAM Lookup Operations through the AXI-Lite Interface 6.3.6. BCAM Lookup Operations through the AXI ST Interface
6.4. Performing MBL Operations x
6.4.1. MBL Flush Operation 6.4.2. MBL Insert Key Operation 6.4.3. MBL Delete Key Operation 6.4.4. MBL Lookup Operation Using Key 6.4.5. MBL Modify Operation 6.4.6. MBL Modify Result Using Handle Operation 6.4.7. MBL Delete Key Using Handle Operation 6.4.8. MBL Lookup Using Handle Operation 6.4.9. MBL Insert Key if Not Present or Modify Result if Present Operation 6.4.10. MBL Get Handle Operation
7. Memory Subsystem Register Descriptions x
7.1. Device Feature Header 7.2. Memory Base Sub-System Global CSR 7.3. Memory Extended Subsystem CSR 7.4. BCAM Registers 7.5. TCAM Registers 7.6. MBL Registers
7.1. Device Feature Header x
7.1.1. Base Mode 7.1.2. Device Feature List Mode
7.1.2. Device Feature List Mode x
7.1.2.1. Device Feature Header 7.1.2.2. Offset 0x8 Feature GUID_L and Feature GUID_H 7.1.2.3. Offset 0x18 Feature_CSR_Addr 7.1.2.4. Offset 0x20 Feature CSR size
7.2. Memory Base Sub-System Global CSR x
7.2.1. Offset 0x0000 Version 7.2.2. Offset 0x0004 Feature List 7.2.3. Offset 0x0010h Interface Attribute Parameters 7.2.4. Offset 0x0020 Scratch Pad 7.2.5. Offset 0x0050 Status 7.2.6. Offset 0x0 0100 - 0x0 0xxx (+0x8h per instance), Additional Attributes Per Instance Lower DW (1 to 16) 7.2.7. Offset 0x0 0104 - 0x0 0xxx (+0x8h per instance) Additional Attributes per Instance Upper DW (1 up to 16) 7.2.8. Offset 0x0 1000 (+0x0 1000h per instance) Efficiency Monitor registers (per instance)
7.3. Memory Extended Subsystem CSR x
7.3.1. Offset 0x0000 Version 7.3.2. Offset 0x0004 Feature List 7.3.3. Offset 0x0010h Interface Attribute Parameters 7.3.4. Offset 0x0020 Scratch Pad
7.4. BCAM Registers x
7.4.1. Device Feature Header (DFH)-Specific Registers 7.4.2. General BCAM Registers
7.4.1. Device Feature Header (DFH)-Specific Registers x
7.4.1.1. Feature_GUID_L and Feature_GUID_H 7.4.1.2. Feature CSR ADDR 7.4.1.3. Feature CSR Size
7.4.2. General BCAM Registers x
7.4.2.1. Version 7.4.2.2. Feature List 7.4.2.3. Interface Attribute Parameters 7.4.2.4. Interface Attribute Parameters 1 7.4.2.5. Scratch Pad 7.4.2.6. General Control (GEN_CTRL) 7.4.2.7. Management Control (MGMT_CTRL) 7.4.2.8. Hash function_0 seed 7.4.2.9. Hash function_1 seed 7.4.2.10. Hash function_2 seed 7.4.2.11. Warning 0 (WARNING_0) 7.4.2.12. Fatal Error (FATAL_ERROR_0) 7.4.2.13. Monitor 0 (MON_) 7.4.2.14. Total Entries (TOTAL_ENTRIES) 7.4.2.15. Max. Rehouse Iterations (Max_Rehouse_Iterations) 7.4.2.16. Statistics Control (STATS_CTRL) 7.4.2.17. Active Table Entries (TABLE_ENTRIES) 7.4.2.18. Key_N 7.4.2.19. Result_N
7.5. TCAM Registers x
7.5.1. Device Feature Header (DFH)-Specific Registers 7.5.2. General TCAM Registers
7.5.1. Device Feature Header (DFH)-Specific Registers x
7.5.1.1. Feature_GUID_L & Feature_GUID_H 7.5.1.2. Feature CSR ADDR 7.5.1.3. Feature CSR Size
7.5.2. General TCAM Registers x
7.5.2.1. Version 7.5.2.2. Feature List 7.5.2.3. Interface Attribute Parameters 7.5.2.4. Scratch 7.5.2.5. Gen_Ctrl 7.5.2.6. Mgmt_Ctrl 7.5.2.7. Entry 7.5.2.8. Warning_0 7.5.2.9. Fatal_Error_0 7.5.2.10. Mon_0 7.5.2.11. Key_N 7.5.2.12. Result_N 7.5.2.13. Match_N 7.5.2.14. Mask_N
7.6. MBL Registers x
7.6.1. General MBL Registers 7.6.2. Version 7.6.3. Mbl_scratch 7.6.4. Mbl_gen_ctrl 7.6.5. Mbl_mgmt_ctrl 7.6.6. Mbl_key_handle 7.6.7. Mbl_nxt_handle_req 7.6.8. Mbl_nxt_handle 7.6.9. Mbl_warning_0 7.6.10. Mbl_fatal_0 7.6.11. Mbl_mon_0 7.6.12. Mbl_total_entries 7.6.13. Mbl_total_rehashes 7.6.14. Mbl_max_used_bins 7.6.15. Mbl_stats_ctrl 7.6.16. Mbl_stats_result 7.6.17. Mbl_max_lkup_latency 7.6.18. Mbl_max_rehash_index 7.6.19. Mbl_key 7.6.20. Mbl_res
8. Parameterizing the Memory Subsystem IP x
8.1. Launching the Memory Subsystem IP 8.2. Parameterization Flow
8.2. Parameterization Flow x
8.2.1. Defining the Number of Memory Interfaces, Type, and Location 8.2.2. Selecting the Required Application Interfaces 8.2.3. Mapping Application to Memory Interfaces (Data Flow) 8.2.4. Generating IPs within the Memory Subsystem 8.2.5. Parameterizing Required EMIF, CAM, and MSA IPs
8.2.5. Parameterizing Required EMIF, CAM, and MSA IPs x
8.2.5.1. Parameterizing the External Memory Interface (EMIF) IP 8.2.5.2. Parameterizing the Memory-Specific Adapter 8.2.5.3. Parameterizing the Content-Addressable Memory (CAM) IP 8.2.5.4. Parameterizing the External Memory Interfaces Intel Calibration IP 8.2.5.5. Saving the IPs Within the Memory Subsystem 8.2.5.6. Propagation of Changes Across IPs within the Memory Subsystem IP
9. Simulating Your Design x
9.1. Generating a Design Example 9.2. Generated Directory Structure for the Design Example 9.3. Steps for Simulation 9.4. Generating Traffic with the Test Engine IP
1. About the Intel Agilex® 7 F-Series and I-Series FPGA Memory Subsystem IP
2. Introduction to Memory Subsystem IP
3. Memory Subsystem IP Architecture and Feature Description
4. Memory Subsystem Features
5. Memory Subsystem Interfaces and Signals
6. Memory Subsystem User Operations
7. Memory Subsystem Register Descriptions
8. Parameterizing the Memory Subsystem IP
9. Simulating Your Design
10. Document Revision History for Intel Agilex® 7 F-Series and I-Series FPGA Memory Subsystem IP User Guide

8.2.5.6. Propagation of Changes Across IPs within the Memory Subsystem IP

Some IPs within the Memory Subsystem IP have parameters that in case of a change, may enable more options or alter the width of a signal connected to another internal IP.

Changing this type of IP parameter in the Platform Designer does not immediately propagate to dependent IPs. To propagate such changes, follow these steps:

  1. Change the required IP parameters within the Memory Subsystem IP in the Platform Designer window.
  2. Save the system and return to the high-level topology IP parameter editor of the Memory Subsystem IP.
  3. Click again Dive into Packaged Subsystem. The system generates with the newest changes.
  4. After the system loads in the Platform Designer, you can verify that all the changes have propagated.

An example of this behavior would be to change the DQ Width on the external memory interface (EMIF) IP. Because the Memory Subsystem IP always adheres an MSA to each EMIF IP, the width of the AXI4 interface on the exported MSA must have an adequate size to send all the required bits to comply with the specified Burst Length of the EMIF controller.

For example, the default DQ width of instantiated EMIF by the Memory Subsystem is 32 bits, this is the reason for the dependent MSA to have, by default, an AXI write data width of 256 bits (32 bits x BL8). If you change the EMIF DQ width to 16 bits, the related MSA AXI data width parameter does not immediately allow you to select a 128 bit write data width. To see this option listed in the parameter of the MSA, you must follow the steps described above.

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