PCB Stackup Design Considerations for Intel® FPGAs

ID 683883
Date 6/28/2017
Document Table of Contents

1.4. PCB Stackup Design

The goal of any PCB stackup design is to select the material and specify the layer ordering such that it adequately delivers the required signal performance and power integrity at the lowest PCB cost. After the appropriate PCB material is selected, consider the following issues to design the layer stackup.