PCB Stackup Design Considerations for Intel® FPGAs

ID 683883
Date 6/28/2017
Document Table of Contents

1.4.1. Layer Count

The total number of layers required for a given design is dependent on the complexity of the board. These factors include the number of signal nets that must break out from the ball-grid array (BGA) device, the number of power planes or pours, and the component density and type of packages for those components. Typically, large BGA device breakouts and individual power or ground plane requirements determine the final board layer count. For complex FPGA boards, the FPGA device in many cases is usually the largest BGA device on the board and thus determines the board’s minimum layer count.