Intel® Server System MCB2224BPAF3R
Essentials
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Product Collection
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Code Name
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Launch Date
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Q2'19
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Marketing Status
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Discontinued
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Expected Discontinuance
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2023
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ISV Certification
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Microsoft Windows Server 2019* Software-Defined Data Center (SDDC) Premium
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Rack Rails Included
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Yes
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Compatible Product Series
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2nd Generation Intel® Xeon® Scalable Processors
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TDP
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125 W
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System Board
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Target Market
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Cloud/Datacenter
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Supplemental Information
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Description
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Intel® Data Center Blocks for Microsoft* Azure* Stack HCI includes Server Board, Chassis, Processor, Solid State Drives and third-party memory, optimized for Storage Spaces Direct and built with Microsoft* Windows* Server 2019 certified ingredients
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Memory & Storage
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Storage Profile
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All-Flash Storage Profile
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Included Memory
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256GB(node)/1024GB(system) DDR4 RAM Raw Memory
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Included Storage
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46.08TB Raw Storage (4x 0.25TB boot device, 46.08TB Capacity Tier)
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Expansion Options
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PCI Express Revision
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3.0
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Security & Reliability
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Intel® AES New Instructions
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Yes
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Intel® Trusted Execution Technology ‡
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Yes
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.