Essentials
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Product Collection
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Code Name
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Marketing Status
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Discontinued
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Launch Date
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Q2'19
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Expected Discontinuance
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2023
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EOL Announce
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Friday, May 5, 2023
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Last Order
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Friday, June 30, 2023
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Limited 3-year Warranty
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Yes
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Extended Warranty Available for Purchase (Select Countries)
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Yes
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Additional Extended Warranty Details
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# of QPI Links
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2
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Supported Operating Systems
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VMware*, Windows Server 2019*, Windows Server 2016*, Red Hat Enterprise Linux 7.6*, Red Hat Enterprise Linux 7.5*, SUSE Linux Enterprise Server 15*, SUSE Linux Enterprise Server 12 SP4*, Ubuntu*
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Compatible Product Series
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2nd Generation Intel® Xeon® Scalable Processors
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Board Form Factor
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Custom 6.8" x 19.1"
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Chassis Form Factor
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2U Rack
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Socket
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Socket P
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Integrated Systems Available
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Yes
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Integrated BMC with IPMI
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IPMI 2.0 & Redfish
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Rack-Friendly Board
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Yes
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TDP
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165 W
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Included Items
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(1) 1U node tray
(1) Intel® Server Board S2600BPSR (1) Power Docking Board FHWBPNPB24 (3) 40x56mm dual rotor managed fans FXX4056DRFAN2 (1) 1U passive Rear heat sink – CPU #1 – CuAL – FXXHP78X108HS (1) 1U passive heat sink – CPU #2 – AL – FXXEA78X108HS (1) Air duct(1) External VGA port bracket (1) Slot 2 riser card w/80mm M.2 SSD slot. Required Items – Sold Separately: (1) bridge board option - AHWBPBGB24, AHWBPBGB24R OR AHWBPBGB24P (1) or (2) 2nd Generation Intel® Xeon® Scalable Processors Up to (16) DDR4 RDIMM/LRDIMM |
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Board Chipset
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Target Market
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High Performance Computing
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Supplemental Information
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Embedded Options Available
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No
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Description
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A hot-pluggable high-density compute module integrated with the Intel® Server Board S2600BPSR for large memory capability and flexible configuration options for the Intel® Server Chassis H2224XXLR3.
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Memory Specifications
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Max Memory Size (dependent on memory type)
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3 TB
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Memory Types
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DDR4 ECC RDIMM/LRDIMM 2133/2400/2666/2933 & Intel® Optane™ DC Persistent Memory Supported
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Max # of Memory Channels
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12
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# of Memory Slots
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16
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ECC Memory Supported ‡
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Yes
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Intel® Optane™ Persistent Memory Supported
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Yes
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GPU Specifications
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Integrated Graphics ‡
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No
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Graphics Output
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VGA
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Expansion Options
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PCI Express Revision
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3.0
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Max # of PCI Express Lanes
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80
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Riser Slot 1: Total # of Lanes
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16
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Riser Slot 2: Total # of Lanes
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24
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Riser Slot 3: Total # of Lanes
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24
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Riser Slot 4: Total # of Lanes
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16
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I/O Specifications
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# of USB Ports
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2
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USB Revision
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3.0
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Total # of SATA Ports
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4
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RAID Configuration
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RAID Levels 0/1/10/5/50 (LSI)
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# of Serial Ports
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1
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# of LAN Ports
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2
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Integrated LAN
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Dual 10GbE SFP+ ports support
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Package Specifications
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Max CPU Configuration
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2
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Advanced Technologies
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Intel® Optane™ Memory Supported ‡
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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Intel® Remote Management Module Support
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Yes
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Intel® Node Manager
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Yes
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TPM Version
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2.0
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Intel® Transparent Supply Chain
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Includes Statement of Conformance and Platform Certificate
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Yes
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Security & Reliability
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Intel® AES New Instructions
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Yes
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Intel® Trusted Execution Technology ‡
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Yes
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.