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  1. Semiconductor Manufacturing Process Technologies

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Build with Leading-Edge Manufacturing Process Technologies

Capitalize on Intel’s legacy of delivering consistent innovation that continues today with Intel Foundry Services (IFS).

Explore Our Advanced Process Technologies

Intel drove major transistor innovation in the past 20 years. With our leadership in manufacturing the Fin-shaped Field-Effect Transistor (FinFET), we raised the 2D transistor channel into the third dimension, greatly improving control of electrons flowing through the channel.

These transistors operate at a lower voltage with lower leakage, providing an unprecedented combination of improved performance and energy efficiency. As a result, transistors are smaller, faster, and use less power than ever before.

We’ve continuously refined FinFET since introducing it nearly a decade ago. Now, we’re driving the next generation of transistor innovation with our RibbonFET and PowerVia breakthrough technologies.

Intel 16: The Ideal Gateway to FinFET

Advantages of FinFET with flexibility of planar:

  • Performance of a 16nm class node with fewer masks and simpler back-end design rules.

Intel 3: Intel’s Ultimate FinFET Node

High-performance per watt with extensive Extreme Ultraviolet (EUV) use:

  • Evolution of Intel 4 with 0.9x logic scaling and 17% performance per watt improvement1.
  • Adds denser library, improved drive current and interconnect while benefiting from Intel 4 learnings for faster yield ramp.
  • Well-suited for general compute applications.

Intel 18A: Biggest Innovation Since FinFET

Introduces RibbonFET and PowerVia:

  • Our biggest innovation since Intel introduced FinFETs to HVM in 2011.
  • Gate-All-Around (GAA) transistor improves density and performance versus FinFET.
  • Optimized ribbon stack delivers superior performance per watt and minimum supply voltage (Vmin).
  • PowerVia is Intel’s unique industry-first implementation of backside power delivery architecture that improves standard cell utilization by 5-10% and performance by greater than 5%2.
  • Well-suited for High Performance Computing (HPC) and mobile applications.

See Our Other World-Class Foundry Offerings

To help you build the next generation of silicon, we’re driving global leadership with numerous investments in manufacturing sites around the world. Our unique offerings are enabled by advanced process technologies complemented by our robust partner ecosystem.

Global Manufacturing

Benefit from a robust, geo-diverse, and expanding supply for wafers and assembly & test.

Learn more

Design Enablement

Reimagine your platform options with a unique combination of technology, IP, and customer support through the IFS Accelerator program.

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Let's Build the Future Together


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Notices and Disclaimers3

Product and Performance Information

1

Based on Intel internal analysis.

2

Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing | IEEE Conference Publication | IEEE Xplore.

3

This webpage contains forward-looking statements about Intel’s future plans or expectations, including with respect to future technology and products and the expected benefits and availability of such technology and products. These statements are based on current expectations and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in such statements. For more information on the factors that could cause actual results to differ materially, see our most recent earnings release and SEC filings at www.intc.com.

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