Build with Leading-Edge Manufacturing Process Technologies
Take advantage of world-class process innovation with Intel Foundry.
World-class Process Innovation
Intel Foundry Direct Connect 2025 delivered the latest roadmap updates, including:
- Intel 14A-E, an enhanced version of Intel 14A.
- Intel 18A-PT, an extension of the Intel 18A family.
- New specialized nodes for Intel 18A.
- A 65-nanometer mature process node expected through joint development with Tower Semiconductor.
Customers ready to design can start their engagement with Intel Foundry today.
Intel 18A: Industry-leading Innovation
Introduces RibbonFET and PowerVia:
- Intel 18A is ready for full product design starts.
- PowerVia, our unique industry-first implementation of backside-power delivery architecture, improves standard cell utilization by 5-10% and ISO-power performance by up to 4%.1
- RibbonFET, Intel Foundry’s implementation of a Gate-all-around (GAA) transistor, improves density and performance versus FinFET.
- Optimized ribbon stack delivers superior performance per watt and minimum supply voltage (Vmin).
- Omni MIM capacitors significantly reduce inductive power droop, enhancing stable chip operation, particularly for modern workloads like generative AI.
- The Intel 18A family continues to expand, providing our customers with new, tailored, cutting-edge solutions for their unique needs.
Intel 3: Intel’s Ultimate FinFET Node
High-performance per watt with extensive Extreme Ultraviolet (EUV) use:
- Evolution of Intel 4 with 1.08x chip density and 18% performance per watt improvement.2
- Adds denser library, improved drive current and interconnect while benefiting from Intel 4 learnings for faster yield ramp.
- Well-suited for general compute applications.
12nm: Expanding Customer Choice in Collaboration with UMC
Expanding our portfolio through an innovative partnership:
- UMC and Intel Foundry are collaborating on the development of a 12nm technology platform, bringing together Intel's FinFET expertise with UMC's logic and mixed-mode/RF experience.
- Competitive to industry 12nm.3
- Offers customer greater choice in their sourcing decisions with access to a more geographically diversified and resilient supply chain.
- Well-suited for high-growth markets such as mobile, wireless connectivity, and networking applications.
Intel 16: The Ideal Gateway to FinFET
Advantages of FinFET with flexibility of planar:
- Performance of a 16nm class node with fewer masks and simpler back-end design rules.
Now Previewing: Intel 14A and Intel 14A-E
Featuring PowerDirect combined with RibbonFET 2
- PowerDirect, our 2nd generation of backside-power delivery network.
- RibbonFET 2, our 2nd generation of gate-all-around technology.
- Introducing Turbo Cells, our boosted cell technology further enhancing speed (including CPU maximum frequency and GPU critical paths) when paired with RibbonFET 2. Turbo Cells allows designers to optimize a mix of more performant cells and more power-efficient cells within a design block, enabling a tailored balance between power, performance, and area for target applications.
- Industry First High Numerical Aperture (High NA) EUV, enabling cost-effective printing of smaller process features.
Intel Foundry Accelerator Ecosystem Alliances
Enjoy comprehensive support in key areas from ecosystem partners across IP, EDA, Design Services, Cloud, USMAG, Value Chain, and Chiplet Alliances.
Industry Leaders Trust Intel Foundry
Customers are confidently choosing Intel Foundry. The world’s two largest cloud-service providers have announced products using Intel 18A technology, part of nine total announced Intel 18A awards.
We have announced plans to establish Intel Foundry as a subsidiary, providing customers with greater assurance and clearer engagement separation.
Intel Foundry Shuttle
Our public, multi-product wafer program that enables design prototyping on Intel’s leading-edge technologies.
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Notices and Disclaimers4
Product and Performance Information
An Intel 3 Advanced FinFET Platform Technology for High Performance Computing and SOC Product Applications, featured as part of the 2024 VLSI Symposium.
According to Node Design Specifications.
This webpage contains forward-looking statements about Intel’s future plans or expectations, including with respect to future technology and products and the expected benefits and availability of such technology and products. These statements are based on current expectations and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in such statements. For more information on the factors that could cause actual results to differ materially, see our most recent earnings release and SEC filings at www.intc.com.