Device Migration Guidelines for Agilex™ 7 R31B Package

ID 826356
Date 6/07/2025
Public
Document Table of Contents

2.2. Key Migration Considerations

The Agilex™ 7 M-Series devices are conditionally compatible for a direct migration from Agilex™ 7 I-Series devices.

The following items must be considered to determine the compatibility and the next step of action for a successful device migration.
  • Zipper
    • The zipper is a block that performs necessary routing adjustments where routing wires cross the zipper. While migrating between packages, you need to consider I/O sub-bank ordering and adjacency. The two sub-banks within an I/O bank are adjacent to each other when there is at least one I/O lane in each sub-bank that is bonded out and available for EMIF use.
  • Changes to Agilex™ 7 M-Series
    • Changes to RZQ and PLL Reference Clock input pin location within Address/Command I/O sub-bank.
    • Pin index changes only impact pin assignments within Quartus® Prime and while developing design. There is no change to the package ball name or location.
    • Address/Command pin placement within sub-bank differs from index 47:0 (Bottom I/O sub-bank) to index 95:48 (Top I/O sub-bank).
    • Data lane (DQ and DQS) location placement is restricted as compared to Agilex™ 7 I-Series devices.
    • Applies only to DIMM.