1. Introduction
2. External Memory Interface
3. I/O Lane Number and I/O Pin Index Mapping
4. Package Height Difference
5. AGI 022/027 to AGM 032/039 Migration
6. AGM 032/039 (HPS) to AGM 032/039 (Non-HPS) Migration
7. Document Revision History for Device Migration Guidelines for Agilex™ 7 R31B Package
2.2. Key Migration Considerations
The Agilex™ 7 M-Series devices are conditionally compatible for a direct migration from Agilex™ 7 I-Series devices.
The following items must be considered to determine the compatibility and the next step of action for a successful device migration.
- Zipper
- The zipper is a block that performs necessary routing adjustments where routing wires cross the zipper. While migrating between packages, you need to consider I/O sub-bank ordering and adjacency. The two sub-banks within an I/O bank are adjacent to each other when there is at least one I/O lane in each sub-bank that is bonded out and available for EMIF use.
- Changes to Agilex™ 7 M-Series
- Changes to RZQ and PLL Reference Clock input pin location within Address/Command I/O sub-bank.
- Pin index changes only impact pin assignments within Quartus® Prime and while developing design. There is no change to the package ball name or location.
- Address/Command pin placement within sub-bank differs from index 47:0 (Bottom I/O sub-bank) to index 95:48 (Top I/O sub-bank).
- Data lane (DQ and DQS) location placement is restricted as compared to Agilex™ 7 I-Series devices.
- Applies only to DIMM.
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