Device Migration Guidelines for Agilex™ 7 R31B Package

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ID 826356
Date 6/07/2025
Public
Document Table of Contents
Document Table of Contents x
1. Introduction 2. External Memory Interface 3. I/O Lane Number and I/O Pin Index Mapping 4. Package Height Difference 5. AGI 022/027 to AGM 032/039 Migration 6. AGM 032/039 (HPS) to AGM 032/039 (Non-HPS) Migration 7. Document Revision History for Device Migration Guidelines for Agilex™ 7 R31B Package
2. External Memory Interface x
2.1. Eligible Migration and System Compatibility 2.2. Key Migration Considerations 2.3. DDR4 Interface Design/Migration Considerations 2.4. EMIF Architecture Differences
2.4. EMIF Architecture Differences x
2.4.1. Key Changes between Agilex™ 7 I-Series and Agilex™ 7 M-Series 2.4.2. Address/Command Pin Index Changes between Agilex™ 7 I-Series and Agilex™ 7 M-Series
2.4.1. Key Changes between Agilex™ 7 I-Series and Agilex™ 7 M-Series x
2.4.1.1. I/O Subsystem 2.4.1.2. HPS EMIF Subsystem
2.4.2. Address/Command Pin Index Changes between Agilex™ 7 I-Series and Agilex™ 7 M-Series x
2.4.2.1. Agilex™ 7 I-Series EMIF Address/Command Pin Information
5. AGI 022/027 to AGM 032/039 Migration x
5.1. I/O PLL 5.2. GPIO 5.3. External Memory Interface 5.4. Power 5.5. LVDS SERDES 5.6. Temperature Sensor
5.2. GPIO x
5.2.1. Migration Path 5.2.2. VCCIO_PIO Voltage Supplies 5.2.3. I/O Types and Standards 5.2.4. I/O Feature 5.2.5. Design Guidelines
5.3. External Memory Interface x
5.3.1. EMIF IP 5.3.2. Data and Data Strobe Pin Index Changes
5.3.2. Data and Data Strobe Pin Index Changes x
5.3.2.1. AGI 022/027 Pin Placement Restrictions when Migrating to AGM 032/039
5.5. LVDS SERDES x
5.5.1. LVDS SERDES IP 5.5.2. LVDS SERDES Performance and Feature Change Comparison
5.5.2. LVDS SERDES Performance and Feature Change Comparison x
5.5.2.1. LVDS SERDES IP Count Per Bank 5.5.2.2. Unused LVDS SERDES Pins
1. Introduction
2. External Memory Interface
3. I/O Lane Number and I/O Pin Index Mapping
4. Package Height Difference
5. AGI 022/027 to AGM 032/039 Migration
6. AGM 032/039 (HPS) to AGM 032/039 (Non-HPS) Migration
7. Document Revision History for Device Migration Guidelines for Agilex™ 7 R31B Package

2.1. Eligible Migration and System Compatibility

The following EMIF interfaces migrations are discussed in this document:
  • DDR4 3ACx72 DIMM
  • DDR4 3ACx64 DIMM
  • DDR4 4ACx72 DIMM
  • DDR4 4ACx64 DIMM
  • HPS DDR4 3ACx40 and 3ACx32, Component Only
Tip: AC: Address/Command scheme.

Migration is only supported if the external memory interface is contained within the 2xIO96 banks. Lane positioning is strictly fixed.

The following interfaces are not supported as part of the migration:
  • AVSTx16 + DDR4x72 (Bank 3A/3B)
  • HPS DDR4 DIMM
Level Two Title