1. Introduction
2. External Memory Interface
3. I/O Lane Number and I/O Pin Index Mapping
4. Package Height Difference
5. AGI 022/027 to AGM 032/039 Migration
6. AGM 032/039 (HPS) to AGM 032/039 (Non-HPS) Migration
7. Document Revision History for Device Migration Guidelines for Agilex™ 7 R31B Package
2.3. DDR4 Interface Design/Migration Considerations
The following table shows the maximum number of DDR4 interfaces, with different interface width, for both 3 I/O lanes and 4 I/O lanes address/command schemes. It also separately highlights HPS EMIF and Fabric EMIF counts.
Device/Package | Migration | Avalon® Streaming Interface Configuration Scheme | DDR I/O Supported | DDR40 Interfaces | DDR72 Compact (3 Lane A/C) | DDR72 (4 Lane A/C) | |||
---|---|---|---|---|---|---|---|---|---|
Fabric EMIF | Fabric and HPS EMIF | Fabric EMIF | Fabric and HPS EMIF | Fabric EMIF | Fabric and HPS EMIF | ||||
AGI 022/027 | No (standalone) | No | 720 | 5 | 4 + HPS (x72/x64) | 4 | 3 + HPS (x72/x64) | 4 | 3 + HPS (x72/x64) |
No | 720 | 5 | 4 + HPS (x40 and less) | 3 | 3 + HPS (x40 and less) | 3 | 3 + HPS (x40 and less) | ||
16, 32 | 672 | 4 | 3 + HPS (x72/x64) | 3 | 2 + HPS (x72/x64) | 3 | 2 + HPS (x72/x64) | ||
16, 32 | 672 | 4 | 3 + HPS (x40 and less) | 3 | 2 + HPS (x40 and less) | 3 | 2 + HPS (x40 and less) | ||
AGM 032/039 | No (standalone) | No | 720 | 5 | 4 + HPS (x40 and less) | 4 | 2 + HPS (x40 and less) | 4 | 3 + HPS (x40 and less) |
16, 32 | 672 | 4 | 3 + HPS (x40 and less) | 3 | 2 + HPS (x40 and less) | 3 | 2 + HPS (x40 and less) | ||
AGI 022/027 to AGM 032/039 | Vertical 1 | No | 720 | 5 | 4 + HPS (x40 and less) | 4 | 3 + HPS (x40 and less) | 4 | 3 + HPS (x40 and less) |
16, 32 | 672 | 4 | 3 + HPS (x40 and less) | 3 | 2 + HPS (x40 and less) | 3 | 2 + HPS (x40 and less) | ||
AGI 022/027 to AGM 032/039 | Vertical1 | No | 432 | 4 | 4 + HPS (x40 and less) | 2 | 2 + HPS (x40 and less) | 1 | 1 + HPS (x40 and less) |
16, 32 | 432 | 4 | 3 + HPS (x40 and less) | 2 | 2 + HPS (x40 and less) | 1 | 1 + HPS (x40 and less) |
1 Migration between FPGA products of different core logic densities in the same package ball count.