HSIO Single-Ended I/O Standards Specifications
HSIO Single-Ended SSTL, HSTL, HSUL, POD, and LVSTL I/O Reference Voltage Specifications
HSIO Single-Ended SSTL, HSTL, HSUL, and POD I/O Standards Signal Specifications
HSIO Single-Ended LVSTL I/O Standards Specifications
HSIO Differential SSTL, HSTL, and HSUL I/O Standards Specifications
HSIO Differential POD I/O Standards Specifications
HSIO Differential LVSTL I/O Standards Specifications
HSIO Differential I/O Standards Specifications
MIPI D-PHY I/O Standards Specifications
HPS Clock Performance
HPS Internal Oscillator Frequency
HPS PLL Specifications
HPS Cold Reset
HPS SPI Timing Characteristics
HPS SD/eMMC Timing Characteristics
HPS USB 2.0 Timing Characteristics
HPS USB 3.1 Timing Characteristics
HPS Ethernet Media Access Controller (EMAC) Timing Characteristics
HPS I2C Timing Characteristics
HPS I3C Timing Characteristics
HPS NAND Timing Characteristics
HPS Trace Timing Characteristics
HPS GPIO Interface
HPS JTAG Timing Characteristics
HPS Programmable I/O Timing Characteristics
HPS I2C Timing Characteristics
Symbol | Description | Standard Mode | Fast Mode | Unit | ||
---|---|---|---|---|---|---|
Min | Max | Min | Max | |||
Fclk | Serial clock (SCL) clock frequency | — | 100 | — | 400 | KHz |
Tclk | Serial clock (SCL) clock period | 10 | — | 2.5 | — | μs |
Tclk_jitter | I2C clock output jitter | — | 2 | — | 2 | % |
THIGH 165 | SCL high period | 4166 | — | 0.6167 | — | μs |
TLOW 168 | SCL low period | 4.7169 | — | 1.3170 | — | μs |
TSU_DAT | Setup time for serial data line (SDA) data to SCL | 0.25 | — | 0.1 | — | μs |
THD_DAT 171 | Hold time for SCL to SDA data | 0 | 3.15 | 0 | 0.6 | μs |
TVD_DAT and TVD_ACK 172 | SCL to SDA output data delay | — | 3.45173 | — | 0.9174 | μs |
TSU_STA | Setup time for a repeated start condition | 4.7 | — | 0.6 | — | μs |
THD_STA | Hold time for a repeated start condition | 4 | — | 0.6 | — | μs |
TSU_STO | Setup time for a stop condition | 4 | — | 0.6 | — | μs |
TBUF | SDA high pulse duration between STOP and START | 4.7 | — | 1.3 | — | μs |
Tscl_r 175 | SCL rise time | — | 1,000 | 20 | 300 | ns |
Tscl_f 175 | SCL fall time | — | 300 | 6.54 | 300 | ns |
Tsda_r 175 | SDA rise time | — | 1,000 | 20 | 300 | ns |
Tsda_f 175 | SDA fall time | — | 300 | 6.54 | 300 | ns |
Figure 23. I2C Timing Diagram
165 You can adjust THIGH using the ic_ss_scl_hcnt or ic_fs_scl_hcnt register.
166 The recommended minimum setting for ic_ss_scl_hcnt is 428. Refer to the SCL_High_time equation in the Hard Processor System Technical Reference Manual.
167 The recommended minimum setting for ic_fs_scl_hcnt is 75. Refer to the SCL_High_time equation in the Hard Processor System Technical Reference Manual.
168 You can adjust TLOW using the ic_ss_scl_lcnt or ic_fs_scl_lcnt register.
169 The recommended minimum setting for ic_ss_scl_lcnt is 464. Refer to the SCL_Low_time equation in the Hard Processor System Technical Reference Manual.
170 The recommended minimum setting for ic_fs_scl_lcnt is 163. Refer to the SCL_Low_time equation in the Hard Processor System Technical Reference Manual.
171 THD_DAT is affected by the rise and fall time.
172 TVD_DAT and TVD_ACK are affected by the rise and fall time, as well as the SDA hold time (set by adjusting the ic_sda_hold register).
173 Use maximum SDA_HOLD = 240 to be within the specification.
174 Use maximum SDA_HOLD = 60 to be within the specification.
175 Rise and fall time parameters vary depending on external factors such as the characteristics of the I/O driver, pull-up resistor value, and total capacitance on the transmission line.