Visible to Intel only — GUID: hcp1660849956952
Ixiasoft
Visible to Intel only — GUID: hcp1660849956952
Ixiasoft
A.14. Thermal Limitations and Protection
The Agilex™ 7 FPGA F-Series (2 × F-Tiles) Development Kit is designed to operate in a typical laboratory environment with an ambient temperature of approximately 25 °C. The cooling solution provided with the development kit allows sufficient cooling for the board to operate up to a maximum power consumption of 150 W (under this environment).
Two MAX31730 3-channel remote temperature sensor devices are connected to the Agilex™ 7 FPGA's internal temperature diodes. The function is to continuously monitor the FPGA's internal core and transceiver tile die temperatures as well as the board inlet and exhaust airflow temperatures when the board is installed inside a server system. Based on the data from both temperature sensors, the Agilex™ 7 FPGA and MAX® 10 run at its maximum speed whenever any temperature is over 60 °C or immediately power off the board whenever the temperature crosses 100 °C to protect the board from damage.