Intel Agilex® 7 F-Series FPGA (Two F-Tiles) Development Kit User Guide

ID 739942
Date 8/07/2023
Document Table of Contents

A.14. Thermal Limitations and Protection

The Intel Agilex® 7 FPGA development kit is designed to operate in a typical laboratory environment with an ambient temperature of approximately 25 °C. The cooling solution provided with the development kit allows sufficient cooling for the board to operate up to a maximum power consumption of 150 W (under this environment).

Two MAX31730 3-channel remote temperature sensor devices are connected to the Intel Agilex® 7 FPGA's internal temperature diodes. The function is to continuously monitor the FPGA's internal core and transceiver tile die temperatures as well as the board inlet and exhaust airflow temperatures when the board is installed inside a server system. Based on the data from both temperature sensors, the Intel Agilex® 7 FPGA and Intel® MAX® 10 run at its maximum speed whenever any temperature is over 60 °C or immediately power off the board whenever the temperature crosses 100 °C to protect the board from damage.

Ensure you unplug the power supply when the board is powered off when the temperature crosses 100 °C. Plug the power supply back again to ensure that the board can be turned on or off again.