AN 522: Implementing Bus LVDS Interface in Supported Intel® FPGA Device Families

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ID 683803
Date 7/31/2018
Public
Document Table of Contents
Document Table of Contents x
Implementing Bus LVDS Interface in Supported Intel® FPGA Device Families
Implementing Bus LVDS Interface in Supported Intel® FPGA Device Families x
BLVDS Overview BLVDS Technology in Intel Devices BLVDS Power Consumption BLVDS Design Example Performance Analysis Document Revision History for AN 522: Implementing Bus LVDS Interface in Supported Intel® FPGA Device Families
BLVDS Overview x
Design Considerations Effective Impedance Propagation Delay
BLVDS Technology in Intel Devices x
I/O Standards for BLVDS Interface in Intel FPGA Devices
BLVDS Design Example x
Design Example Guidelines for Intel® Stratix® 10 Devices Design Example Guidelines for Intel® Arria® 10 Devices Design Example Guidelines for Intel® MAX® 10 Devices Design Example Guidelines for All Supported Devices Except Intel® Arria® 10, Intel® Cyclone® 10 GX, and Intel® MAX® 10
Performance Analysis x
System Setup Bus Termination Stub Length Stub Termination Driver Slew Rate Overall System Performance
Implementing Bus LVDS Interface in Supported Intel® FPGA Device Families

Stub Termination

You must match the driver impedance to the stub characteristic impedance. Placing a series termination resistor RS at the driver output greatly reduces the adverse transmission line effect caused by long stub and fast edge rates. In addition, RS can be changed to attenuate the VID to meet the specification of the receiver.
Figure 21. Effect of Stub Termination (Driver in U1, Receiver in U2 and U10)This figure compares the VID at U2 and U10 when U1 is transmitting.


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