Intel® Cyclone® 10 GX Device Overview

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ID 683485
Date 4/01/2019
Public
Document Table of Contents

FPGA General Purpose I/O

Intel® Cyclone® 10 GX devices offer highly configurable GPIOs. Each I/O bank contains 48 general purpose I/Os and a high-efficiency hard memory controller.

The following list describes the features of the GPIOs:

  • Consist of 3 V I/Os for high-voltage application and LVDS I/Os for differential signaling
    • One 3 V I/O bank that supports up to 3 V I/O standards
    • LVDS I/O banks that support up to 1.8 V I/O standards
  • Support a wide range of single-ended and differential I/O interfaces
  • LVDS speeds up to 1.434 Gbps
  • Each LVDS pair of pins has differential input and output buffers, allowing you to configure the LVDS direction for each pair.
  • Programmable bus hold and weak pull-up
  • Programmable differential output voltage (VOD) and programmable pre-emphasis
  • Series (RS ) and parallel (RT ) on-chip termination (OCT) for all I/O banks with OCT calibration to limit the termination impedance variation
  • On-chip dynamic termination that has the ability to swap between series and parallel termination, depending on whether there is read or write on a common bus for signal integrity
  • Easy timing closure support using the hard read FIFO in the input register path, and delay-locked loop (DLL) delay chain with fine and coarse architecture

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