Cyclone® 10 GX Device Overview

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ID 683485
Date 4/01/2019
Public
Document Table of Contents
Document Table of Contents x
Intel® Cyclone® 10 GX Device Overview
Intel® Cyclone® 10 GX Device Overview x
Key Advantages of Intel® Cyclone® 10 GX Devices Summary of Intel® Cyclone® 10 GX Features Intel® Cyclone® 10 GX Available Options Intel® Cyclone® 10 GX Maximum Resources Intel® Cyclone® 10 GX Package Plan I/O Vertical Migration for Intel® Cyclone® 10 GX Devices Adaptive Logic Module Variable-Precision DSP Block Embedded Memory Blocks Clock Networks and PLL Clock Sources FPGA General Purpose I/O External Memory Interface PCIe Gen1 and Gen2 Hard IP Enhanced PCS Hard IP for Interlaken and 10 Gbps Ethernet Low Power Serial Transceivers Dynamic and Partial Reconfiguration Enhanced Configuration and Configuration via Protocol SEU Error Detection and Correction Power Management Incremental Compilation Document Revision History for Intel® Cyclone® 10 GX Device Overview
Embedded Memory Blocks x
Types of Embedded Memory Embedded Memory Capacity in Intel® Cyclone® 10 GX Devices Embedded Memory Configurations for Single-port Mode
Clock Networks and PLL Clock Sources x
Clock Networks Fractional Synthesis and I/O PLLs
Fractional Synthesis and I/O PLLs x
Fractional Synthesis PLLs I/O PLLs
External Memory Interface x
Memory Standards Supported by Intel® Cyclone® 10 GX Devices
Enhanced PCS Hard IP for Interlaken and 10 Gbps Ethernet x
Interlaken Support 10 Gbps Ethernet Support
Low Power Serial Transceivers x
Transceiver Channels PMA Features PCS Features
PCS Features x
PCS Protocol Support
Dynamic and Partial Reconfiguration x
Dynamic Reconfiguration Partial Reconfiguration
Intel® Cyclone® 10 GX Device Overview

FPGA General Purpose I/O

Intel® Cyclone® 10 GX devices offer highly configurable GPIOs. Each I/O bank contains 48 general purpose I/Os and a high-efficiency hard memory controller.

The following list describes the features of the GPIOs:

  • Consist of 3 V I/Os for high-voltage application and LVDS I/Os for differential signaling
    • One 3 V I/O bank that supports up to 3 V I/O standards
    • LVDS I/O banks that support up to 1.8 V I/O standards
  • Support a wide range of single-ended and differential I/O interfaces
  • LVDS speeds up to 1.434 Gbps
  • Each LVDS pair of pins has differential input and output buffers, allowing you to configure the LVDS direction for each pair.
  • Programmable bus hold and weak pull-up
  • Programmable differential output voltage (VOD) and programmable pre-emphasis
  • Series (RS ) and parallel (RT ) on-chip termination (OCT) for all I/O banks with OCT calibration to limit the termination impedance variation
  • On-chip dynamic termination that has the ability to swap between series and parallel termination, depending on whether there is read or write on a common bus for signal integrity
  • Easy timing closure support using the hard read FIFO in the input register path, and delay-locked loop (DLL) delay chain with fine and coarse architecture
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