Early Power Estimator User Guide

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ID 683272
Date 7/16/2021
Public
Document Table of Contents
Document Table of Contents x
1. Early Power Estimator Overview 2. Setting Up the Early Power Estimator 3. Early Power Estimator Worksheets 4. Factors Affecting the Early Power Estimator Spreadsheet Accuracy A. Additional Information for Early Power Estimator User Guide
1. Early Power Estimator Overview x
1.1. Release Information 1.2. Power Model Status for Supported Device Families
2. Setting Up the Early Power Estimator x
2.1. System Requirements 2.2. Download and Install the Early Power Estimator 2.3. Estimating Power Consumption
2.2. Download and Install the Early Power Estimator x
2.2.1. Changing the Macro Security Level in Microsoft Excel 2003 2.2.2. Changing the Macro Security Level in Microsoft Excel 2007 2.2.3. Changing the Macro Security Level in Microsoft Excel 2010
2.3. Estimating Power Consumption x
2.3.1. Estimating Power Consumption Before Starting the FPGA Design 2.3.2. Estimating Power Consumption While Creating the FPGA Design 2.3.3. Estimating Power Consumption After Completing the FPGA Design
2.3.1. Estimating Power Consumption Before Starting the FPGA Design x
2.3.1.1. Entering Information into the Early Power Estimator
2.3.1.1. Entering Information into the Early Power Estimator x
2.3.1.1.1. Manually Entering Values
2.3.2. Estimating Power Consumption While Creating the FPGA Design x
2.3.2.1. Importing a File
2.3.2.1. Importing a File x
2.3.2.1.1. Generate the EPE File 2.3.2.1.2. Import Data into the EPE Spreadsheet
3. Early Power Estimator Worksheets x
3.1. Main Worksheet 3.2. Logic Worksheet 3.3. RAM Worksheet 3.4. DSP Worksheet 3.5. I/O Worksheet 3.6. PLL Worksheet 3.7. Clock Worksheet 3.8. HSDI Worksheet 3.9. XCVR Worksheet 3.10. HMC Worksheet 3.11. IP Worksheet 3.12. HPS Worksheet 3.13. Report Worksheet 3.14. Enpirion Worksheet
3.1. Main Worksheet x
3.1.1. Input Parameter 3.1.2. Thermal Power 3.1.3. Power Tree Design 3.1.4. Thermal Analysis
3.1.4. Thermal Analysis x
3.1.4.1. Not Using a Heat Sink 3.1.4.2. Using a Heat Sink
3.13. Report Worksheet x
3.13.1. Static Power and Dynamic Current per Voltage Rail 3.13.2. Power Up Current 3.13.3. Power Breakout for Multiple Voltage Supplies 3.13.4. Power Regulator Settings
4. Factors Affecting the Early Power Estimator Spreadsheet Accuracy x
4.1. Toggle Rate 4.2. Airflow 4.3. Temperature 4.4. Heat Sink
A. Additional Information for Early Power Estimator User Guide x
A.1. Document Revision History for Early Power Estimator User Guide
1. Early Power Estimator Overview
2. Setting Up the Early Power Estimator
3. Early Power Estimator Worksheets
4. Factors Affecting the Early Power Estimator Spreadsheet Accuracy
A. Additional Information for Early Power Estimator User Guide

4.3. Temperature

To calculate the thermal information of the device correctly, you are required to enter the ambient air temperature for the device in the EPE spreadsheet. Ambient temperature refers to the temperature of the air around the device. The temperature of the air around the device is usually higher than the ambient temperature outside of the system. To get an accurate representation of ambient temperature for the device, you must measure the temperature as close to the device as possible with a thermocouple device.

Entering the incorrect ambient air temperature can drastically alter the power estimates in the EPE spreadsheet. The following figure shows a simple system with the FPGA housed in a box. In this case, the temperature is very different at each of the numbered locations.

Figure 34. Temperature Variances

For example, location 3 is where the ambient temperature pertaining to the device should be obtained for input into the EPE spreadsheet. Locations 1 and 2 are cooler than location 3 and location 4 is likely close to 25 °C if the ambient temperature outside the box is 25 °C. Temperatures close to devices in a system are often in the neighborhood of 50–60 °C but the values can vary significantly. To obtain accurate power estimates from the EPE spreadsheet, you must get a realistic estimate of the ambient temperature near the FPGA device.

Level Two Title