4.4. Heat Sink
The following equations show how to determine power when using a heat sink.
Figure 35. Total Power
Figure 36. Junction–to–Ambient Thermal Resistance
You can obtain the θJC value that is specific to the FPGA from the data sheet. The θCS value refers to the material that binds the heat sink to the FPGA and is approximated to be 0.1 °C/W. You can obtain the θSA value from the manufacturer of the heat sink. Ensure that you obtain this value for the right conditions for the FPGA which include analyzing the correct heat sink information at the appropriate airflow at the device.
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