America’s semiconductor leadership starts with Intel

Intel is leading the way to revitalize American semiconductor manufacturing and research and development to build a more resilient global supply chain. Intel expects to invest more than $100 billion in the U.S. to expand our manufacturing capacity and capabilities in Arizona, New Mexico, Oregon, and Ohio. These investments, supported by CHIPS Act funding of up to $7.86 billion, will fill several essential domestic supply chain gaps and are critical to U.S. economic and national security.

The future of American semiconductor manufacturing starts in Oregon, which is home to Intel’s leading-edge semiconductor research, technology development and manufacturing. Intel plans to invest more than $36 billion in Hillsboro, which will enable Intel to deliver industry-leading process technology beyond 2025.

Intel is investing over $32 billion to build two new leading-edge chip factories and modernize an existing fab at its Ocotillo campus in Chandler, Arizona, that will produce the world’s most advanced logic chips. The new factories will support the growing demand for Intel’s products and provide committed capacity for Intel Foundry customers.

Intel is investing more than $4 billion in its New Mexico operations to equip its operations to manufacture advanced semiconductor packaging technologies, including Foveros, Intel’s breakthrough 3D packaging technology.

Intel’s greenfield investment of more than $28 billion to build two new leading-edge fabs in Ohio marks the single largest private-sector investment in the state’s history. In 2022, we broke ground in the “Silicon Heartland” to establish a new regional economic cluster for U.S. chipmaking and become an epicenter of leading-edge technology.

As the only leading-edge U.S. semiconductor company that both develops and manufactures its own technology, Intel has a widespread economic impact in every sector of the U.S. economy:

Intel is committed to doubling down on our U.S. investments to bring more manufacturing and technology leadership to the U.S. Powered by the promises of the CHIPS and Science Act, our new investments are expected to:

Intel Foundry is deploying a new, world-first approach to full stack solution support for accelerated time to market, leading the industry transition from “system on chip” to “system of chips.”

In September 2024, Intel won a manufacturing contract for up to $3 billion for the Secure Enclave program. This program is designed to expand the trusted manufacturing of leading-edge semiconductors for the U.S. government and builds on Intel’s relationship with the U.S. Department of Defense to provide end-to-end ability to leverage capabilities in the United States through the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) and State-of-the-Art Heterogeneous Integrated Packaging (SHIP) programs.

Intel is nearing completion of a historic pace of semiconductor node development to regain process technology leadership. Intel 18A, the company’s fifth process node in four years, is on track to launch in 2025 and continues to gain traction with customers. The company is finalizing a multiyear, multibillion-dollar commitment by Amazon Web Services to expand its existing partnership to include a new custom Intel® Xeon® 6 chip on Intel 3 and a new AI fabric chip on Intel 18A.

Intel is also pioneering the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the continued scaling of transistors in a package and advance Moore’s Law to deliver data-centric applications.

While it is becoming exponentially more challenging to keep pace with Moore's Law as the industry aspires to deliver 1 trillion transistors on a single device by 2030, Intel is executing on or ahead of schedule to deliver five process nodes in four years and return process technology leadership to the U.S. by 2025 with robust investment plans to maintain that leadership once regained.

Through innovative partnerships with government and academia, Intel is leading the way to create a robust and expansive ecosystem of skilled semiconductor talent, which is critical to the success of the entire semiconductor industry and the U.S. economy.

Intel announced a $100 million investment in 2022 to expand semiconductor education, research and workforce training opportunities across the nation, which includes a $50 million partnership with the National Science Foundation and $50 million to fund the Semiconductor Education and Research Program (SERP) for Ohio – a collaborative, multi-institution program designed to directly support our new operations in Ohio. Through this program, for example, Columbus State Community College has taken the lead on developing a one-year semiconductor technician certificate program.

Once given little attention in chipmaking, packages are changing how chips are designed and created – and, ultimately, what chips can do.

The passage of the CHIPS and Science Act shined a spotlight on the critical need to invest in U.S. domestic semiconductor manufacturing.