Intel® Curie™ Module

Intel® Quark™ SE SoC

Intel® Curie™ Module

Intel® Quark™ SE SoC

Essentials

Product Collection
Intel® Curie™ Modules
New Design Availability Expiration Date
Sunday, March 28, 2021

Supplemental Information

Marketing Status
Discontinued
Launch Date
Q1'16
Expected Discontinuance
07/17/2017
Embedded Options Available
No
Extended Life Program (XLP)
No
Datasheet
View now
Description
The Intel Curie module is built around the Intel Quark SE SoC integrating compute & sense. The module includes x86 host CPU, sensor hub, Pattern Matching Engine, Bluetooth Low Energy, 6-axis Accelerometor & gyroPMIC & Battery charging unit.

Memory & Storage

Memory Types
384 kB on-die flash, 80 kB on-die SRAM

I/O Specifications

# of USB Ports
1
USB Revision
1.1
Integrated Bluetooth
Yes
# of QPI Links
0
FSB Parity
No

Package Specifications

TDP
0.3 W
DC Input Voltage Supported
3.3 VDC
Package Size
11.05 x 8.10 mm

Advanced Technologies

Intel® Remote Wake Technology
No
Intel® CIRA Technology
No
Intel® Quick Resume Technology
No
Intel® Quiet System Technology
No
Intel® HD Audio Technology
No
Intel® AC97 Technology
No
Intel® Matrix Storage Technology
No
Intel® Rapid Storage Technology
No
Intel® Rapid Storage Technology enterprise
No
Intel® Fast Memory Access
No
Intel® Flex Memory Access
No
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
No
Intel® Virtualization Technology (VT-x) ‡
No

Security & Reliability

TPM
No
Intel® AES New Instructions
No
Intel® Trusted Execution Technology ‡
No
Back-to-BIOS Button
No
Intel® Remote PC Assist Technology
No
Anti-Theft Technology
No

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.

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