Intel® Server System R1304SP2SHBN
Essentials
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Product Collection
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Code Name
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Launch Date
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Q4'12
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Marketing Status
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Discontinued
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Expected Discontinuance
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Q2'14
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EOL Announce
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Friday, June 6, 2014
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Last Order
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Friday, September 5, 2014
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Last Receipt Attributes
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Wednesday, December 3, 2014
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Limited 3-year Warranty
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Yes
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Extended Warranty Available for Purchase (Select Countries)
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Yes
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Additional Extended Warranty Details
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Chassis Form Factor
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1U Rack
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Chassis Dimensions
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1.7" x 17.2" x 21.8"
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Board Form Factor
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ATX
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Rack Rails Included
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Yes
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Compatible Product Series
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Intel® Xeon® Processor E5-2400 v2 Family
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Socket
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Socket R3
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TDP
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145 W
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Heat Sink
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1
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Heat Sink Included
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Yes
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System Board
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Board Chipset
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Target Market
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Embedded
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Rack-Friendly Board
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Yes
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Power Supply
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350 W
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Power Supply Type
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AC
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# of Power Supply Included
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1
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Redundant Fans
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No
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Redundant Power Supported
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No
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Backplanes
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Included
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Included Items
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(1) Intel® Server Board S2600WT2
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Memory & Storage
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Memory Types
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DDR3 ECC UDIMM 1333/1600, RDIMM 1333/1600
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|---|---|
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# of Memory Slots
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6
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Max Memory Size (dependent on memory type)
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96 GB
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# of Front Drives Supported
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4
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Front Drive Form Factor
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Hot-swap 2.5" or 3.5"
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GPU Specifications
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Integrated Graphics ‡
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Yes
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|---|
Expansion Options
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PCIe x8 Gen 3
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1
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|---|---|
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Connector for Intel® I/O Expansion Module x8 Gen 3
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1
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Connector for Intel® Integrated RAID Module
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1
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I/O Specifications
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# of USB Ports
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13
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|---|---|
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Total # of SATA Ports
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14
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RAID Configuration
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Software RAID 0,1,10,5 (LSI RSTE)
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# of Serial Ports
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2
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Integrated LAN
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2x 1GbE
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# of LAN Ports
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2
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Optical Drive Support
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Yes
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Firewire
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No
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Integrated SAS Ports
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0
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Embedded USB (eUSB) Solid State Drive Option
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Yes
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Integrated InfiniBand*
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No
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Package Specifications
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Max CPU Configuration
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1
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Advanced Technologies
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Intel® Remote Management Module Support
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Yes
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|---|---|
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Integrated BMC with IPMI
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IPMI 2.0 with OEM extensions
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Intel® Node Manager
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Yes
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Intel® On-Demand Redundant Power
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No
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Intel® Advanced Management Technology
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Yes
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Intel® Server Customization Technology
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Yes
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Intel® Build Assurance Technology
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Yes
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Intel® Efficient Power Technology
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Yes
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Intel® Quiet Thermal Technology
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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Intel® Matrix Storage Technology
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No
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Intel® Rapid Storage Technology
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No
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Intel® Rapid Storage Technology enterprise
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Yes
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TPM Version
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1.2
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.