Intel® Server System D50DNP2MHSVAC Management Module
Essentials
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Product Collection
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Code Name
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Launch Date
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Q1'23
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Marketing Status
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Discontinued
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Expected Discontinuance
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2023
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EOL Announce
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Friday, May 5, 2023
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Last Order
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Friday, June 30, 2023
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Limited 3-year Warranty
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Yes
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Extended Warranty Available for Purchase (Select Countries)
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Yes
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Supported Operating Systems
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VMware*, Windows Server 2022*, Windows Server 2019*, Red Hat Linux*, SUSE Linux*, Ubuntu*, CentOS*
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Chassis Form Factor
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2U Rack front IO
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Chassis Dimensions
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591.4 x 216 x 81.9 mm (L x W x H)
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Board Form Factor
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8.33” x 21.5”
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Rack Rails Included
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Yes
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Compatible Product Series
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4th Gen Intel® Xeon® Scalable Processors, 5th Gen Intel® Xeon® Scalable Processors
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Socket
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Socket- E LGA4677
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TDP
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350 W
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Heat Sink
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(1) – 2U air-cooled heat sink front – iPC DNP2UHSF
(1) – 2U air-cooled heat sink back – iPC DNP2UHSB |
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Heat Sink Included
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Yes
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System Board
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Board Chipset
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Target Market
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High Performance Computing, Scalable Performance
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Rack-Friendly Board
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Yes
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Included Items
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(1) – Intel® Server Board D50DNP1SB – iPC D50DNP1SB
(1) – 2U half-width module tray – iPN M44836-xxx (1) – 2U management module air duct – iPN M44894-xxx (1) – MCIO cable for 2U right riser – iPN M40564-xxx (1) – MCIO cable for 2U left riser – iPN M40565-xxx (2) – 2U riser bracket to support riser card DNP2UMRISER – iPN M44892-xxx (2) – 2U low-profile PCIe MCIO riser card – iPC DNP2UMRISER (2) – U.2 PCIe NVMe* SSD adapter card – iPN K50874-xxx (2) – 2.5” tool-less SSD drive carrier – iPN J36439-xxx (1) – 2U air-cooled heat sink front – iPC DNP2UHSF (1) – 2U air-cooled heat sink back – iPC DNP2UHSB |
Supplemental Information
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Description
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Density-optimized 2U management module designed for HPC and AI applications.
Supports two 4th Gen Intel® Xeon® Scalable or Intel® Xeon® CPU Max Series processors and up to 16 DDR5 DIMMs. |
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Memory & Storage
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Memory Types
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• DDR5 RDIMM
• DDR5 3DS-RDIMM • DDR5 9x4 RDIMM |
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# of Memory Slots
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16
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Max Memory Size (dependent on memory type)
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2 TB
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# of Front Drives Supported
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2
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Front Drive Form Factor
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Hot-swap 2.5"
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# of Internal Drives Supported
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2
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Internal Drive Form Factor
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M.2 SSD
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Intel® Optane™ Persistent Memory Supported
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No
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GPU Specifications
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Integrated Graphics ‡
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Yes
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Expansion Options
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PCI Express Revision
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5.0
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Riser Slot 1: Total # of Lanes
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24
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Riser Slot 2: Total # of Lanes
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24
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I/O Specifications
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# of USB Ports
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3
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Total # of SATA Ports
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2
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USB Configuration
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• One USB 3.0 port on the front panel
• Two USB 3.0 ports via breakout cable |
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Max # of UPI Links
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3
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# of Serial Ports
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1
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Integrated LAN
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10Gb Ethernet (RJ45) and 1Gb Ethernet (RJ45)
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# of LAN Ports
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2
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Package Specifications
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Max CPU Configuration
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2
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Advanced Technologies
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Advanced System Management key
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Yes
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Intel® Optane™ Memory Supported ‡
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No
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Intel® Remote Management Module Support
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Yes
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Integrated BMC with IPMI
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IPMI 2.0 and Redfish compliant
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Intel® Node Manager
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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Intel® Rapid Storage Technology enterprise
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Yes
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TPM Version
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2.0
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Security & Reliability
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Intel® Total Memory Encryption
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Yes
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Intel® Software Guard Extensions (Intel® SGX)
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Yes with Intel® SPS
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Intel® AES New Instructions
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Yes
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Intel® Trusted Execution Technology ‡
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Yes
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
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This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.