Intel Server System D40AMP1MHCPAC Compute Module (1U Half-Width Air-Cooled)
Essentials
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Product Collection
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Code Name
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Launch Date
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Q4'21
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Marketing Status
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Discontinued
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Expected Discontinuance
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31 DEC 2022
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EOL Announce
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Monday, July 11, 2022
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Last Order
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Wednesday, November 30, 2022
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Limited 3-year Warranty
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Yes
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Extended Warranty Available for Purchase (Select Countries)
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Yes
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Additional Extended Warranty Details
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Supported Operating Systems
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VMware ESXi* 7.0, Windows Server 2022*, Windows Server 2019*, Red Hat Enterprise Linux 8.4*, SUSE Linux Enterprise Server 15 SP3*
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Chassis Form Factor
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Rack
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Board Form Factor
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8.33” x 21.5”
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Compatible Product Series
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3rd Generation Intel® Xeon® Scalable Processors
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Socket
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Dual Socket-P4 4189
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TDP
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205 W
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System Board
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Target Market
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High Performance Computing
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Rack-Friendly Board
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Yes
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Included Items
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(1) 1U half-width module tray – iPN M28502-xxx
(1) Intel® Server Board D40AMP1SB (1) 1U compute module airduct – iPN K61940-xxx (2) 1U low-profile PCIe* riser card –TNP1UCRRISER (2) 1U riser bracket to support TNP1UCRRISER- iPN K25206-xxx (1) 1U Air-Cooled front Heat Sink TNP1UHSF (1) 1U Air-Cooled Rear Heat Sink TNP1UHSB (2) Processor carrier clip, for 3rd Gen Intel® Xeon® processor Scalable supported by D40AMP product family – iPN J98484-xxx (2) M.2 heatsink assembly TNPM2HS |
Supplemental Information
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Description
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1U half-width compute module with the Intel® Server Board D40AMP at its heart and supporting the 3rd Gen Intel® Xeon® Scalable processors, it builds upon its features to provide support for internal storage, and PCIe* 4.0 expansion options
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Memory & Storage
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Storage Profile
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All-Flash Storage Profile
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Memory Types
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DDR4 (RDIMM)
3DS-RDIMM Load Reduced DDR4 (LRDIMM) 3DS-LRDIMM |
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# of Memory Slots
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24
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Max Memory Size (dependent on memory type)
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6 TB
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Intel® Optane™ Persistent Memory Supported
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Yes
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GPU Specifications
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Integrated Graphics ‡
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Yes
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Expansion Options
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PCI Express Revision
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4.0
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Riser Slot 1: Total # of Lanes
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16
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Riser Slot 2: Total # of Lanes
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16
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I/O Specifications
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# of USB Ports
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3
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Total # of SATA Ports
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2
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USB Configuration
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(1) USB 3.0 ports
(2) USB 3.0 ports (dual-stack on break-out cable) |
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Max # of UPI Links
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3
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RAID Configuration
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0/1/5
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# of Serial Ports
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1
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Integrated LAN
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1
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Package Specifications
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Max CPU Configuration
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2
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Advanced Technologies
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Advanced System Management key
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Yes
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Intel® Optane™ Memory Supported ‡
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Yes
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Integrated BMC with IPMI
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IPMI 2.0 & Redfish
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Intel® Node Manager
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Yes
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Intel® On-Demand Redundant Power
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Yes
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Intel® Advanced Management Technology
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Yes
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Intel® Server Customization Technology
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Yes
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Intel® Efficient Power Technology
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Yes
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Intel® Quiet Thermal Technology
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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Intel® Quiet System Technology
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Yes
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Intel® Flex Memory Access
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Yes
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TPM Version
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2.0
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.