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(2) DIMM slots with supports for standard DDR4
(2) Processor carrier clip, for 3rd Gen Intel® Xeon® Scalable processor family – iPN J98484-xxx
(9) Heat sinks for voltage regulators
(4) DIMM baffles – iPN M19136-xxx
(8) Plastic rivets for DIMM baffles – iPN M19137-xxx
With either air-cooling or liquid-cooling.
-Load Reduced DDR4 (LRDIMM)
(2) USB 3.0 ports (dual-stack)
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Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
Retail prices reported as of 20 Jan 2022 22:34:59 GMT