Intel® Server System D50TNP2MHSTAC Storage Module
Essentials
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Product Collection
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Code Name
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Marketing Status
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Discontinued
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Launch Date
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Q3'21
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Expected Discontinuance
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2023
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EOL Announce
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Friday, May 5, 2023
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Last Order
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Friday, June 30, 2023
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Limited 3-year Warranty
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Yes
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Extended Warranty Available for Purchase (Select Countries)
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Yes
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Additional Extended Warranty Details
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Compatible Product Series
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3rd Generation Intel® Xeon® Scalable Processors
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Board Form Factor
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8.33” x 21.5”
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Chassis Form Factor
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2U Rack
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Socket
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Socket-P4
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Integrated BMC with IPMI
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IPMI 2.0 & Redfish
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Rack-Friendly Board
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Yes
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TDP
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205 W
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Included Items
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(1) Intel® Server Board D50TNP1SB
(1) 2U half-width module tray – iPN K74857 (1) 1U storage module air duct right – iPN K88592 (1) 1U storage module air duct left – iPN K88590 (2) 1U riser bracket to support TNP1URISER – iPN K25206 (2) M.2 heat sink assembly TNPM2HS (1) 1U Air-Cooled front Heat Sink TNP1UHSF (1) 1U Air-Cooled Rear Heat Sink TNP1UHSB (2) Processor clip, for 3rd Gen Intel® Xeon® Scalable processor family – iPN J98484 (1) Storage Compute Module Docking Board TNPSTDCKBRD (2) OCuLink cable 520 mm – iPN K73563 (2) OCuLink cable 125 mm – iPN K73567 (2) OCuLink cable 145 mm – iPN K73568 (2) OCuLink cable 140 mm – iPN K73570 (1 each) OCuLink connector covers for J25, J26, J29, and J30 – iPN K74231 (1 each) OCuLink connector covers for J27 and J28 – iPN K74230 |
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Board Chipset
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Target Market
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High Performance Computing
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Supplemental Information
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Embedded Options Available
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No
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Description
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A 2U high-density Storage module integrated with the Intel® Server Board D50TNP1SB intended for dense and fast storage solutions, supports up to 16 EDSFF E1.L NVMe* SSDs.
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Memory Specifications
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Max Memory Size (dependent on memory type)
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6 TB
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Memory Types
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-DDR4 (RDIMM)
-3DS-RDIMM -Load Reduced DDR4 (LRDIMM) -3DS-LRDIMM -Intel® Optane™ persistent memory 200 series modules |
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Max # of Memory Channels
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16
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Max Memory Bandwidth
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204.8 GB/s
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# of Memory Slots
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24
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ECC Memory Supported ‡
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Yes
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Intel® Optane™ Persistent Memory Supported
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Yes
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GPU Specifications
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Integrated Graphics ‡
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Yes
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Graphics Output
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VGA
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Expansion Options
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PCI Express Revision
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4.0
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Max # of PCI Express Lanes
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56
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PCIe OCuLink Connectors (NVMe support)
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8
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Riser Slot 1: Total # of Lanes
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32
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Riser Slot 2: Total # of Lanes
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24
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I/O Specifications
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# of USB Ports
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3
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USB Configuration
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• One USB 3.0 port
• Two USB 3.0 ports (dual-stack) |
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USB Revision
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3.0
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Total # of SATA Ports
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2
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Max # of UPI Links
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3
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RAID Configuration
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0/1/5
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# of Serial Ports
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1
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Integrated LAN
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1
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Package Specifications
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Max CPU Configuration
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2
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Advanced Technologies
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Advanced System Management key
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Yes
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Intel® Optane™ Memory Supported ‡
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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Intel® Node Manager
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Yes
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Intel® Advanced Management Technology
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Yes
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TPM Version
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2.0
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Security & Reliability
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Intel® AES New Instructions
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Yes
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Intel® Trusted Execution Technology ‡
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Yes
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.