Intel® Server System S9232WK2HLC Compute Module
Essentials
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Product Collection
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Code Name
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Marketing Status
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Discontinued
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Launch Date
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Q3'19
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Expected Discontinuance
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2022
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EOL Announce
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Friday, July 1, 2022
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Last Order
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Wednesday, November 30, 2022
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Limited 3-year Warranty
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Yes
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Supported Operating Systems
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Red Hat Enterprise Linux 7.6*, SUSE Linux Enterprise Server 12 SP4*, CentOS 7.4*
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Board Form Factor
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8.33” x 21.5”
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Chassis Form Factor
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2U Rack front IO
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Integrated Systems Available
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Yes
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Integrated BMC with IPMI
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2.0
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TDP
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250 W
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Included Items
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(1) Server board
(1) 2U service module tray (2) Intel® Xeon® Platinum 9222 Processor (2) 2U riser assembly (1) Liquid cooling loop kit |
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Board Chipset
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Target Market
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High Performance Computing
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Supplemental Information
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Description
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S9200WK Compute Module for use in Intel® Data Center Blocks featuring Intel® Xeon®
Platinum 9200 processors housed in new 2U front I/O Intel® Server Chassis FC2000. |
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Memory Specifications
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Max Memory Size (dependent on memory type)
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3 TB
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Memory Types
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DDR4 RDIMM 2933
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Max # of Memory Channels
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24
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Intel® Optane™ Persistent Memory Supported
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No
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Expansion Options
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PCIe x16 Gen 3
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4
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Package Specifications
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Max CPU Configuration
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2
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Advanced Technologies
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Intel® Optane™ Memory Supported ‡
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No
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TPM Version
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2.0
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.