Intel® Server System ZSB2224BPAF2
Essentials
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Product Collection
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Code Name
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Launch Date
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Q3'18
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Marketing Status
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Discontinued
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Expected Discontinuance
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Q1'19
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EOL Announce
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Friday, March 8, 2019
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Last Order
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Friday, March 8, 2019
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Last Receipt Attributes
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Friday, March 8, 2019
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Limited 3-year Warranty
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Yes
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Chassis Form Factor
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2U, 4 node Rack Chassis
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Chassis Dimensions
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3.46" x 17.24" x 28.86"
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Socket
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Socket P
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TDP
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140 W
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Heat Sink
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(4) 1U passive heat sink – CPU #1 – CuAL – FXXHP78X108HS
(4) 1U passive heat sink – CPU #2 – AL – FXXEA78X108HS |
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Heat Sink Included
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Yes
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System Board
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Board Chipset
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Target Market
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Cloud/Datacenter
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Rack-Friendly Board
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Yes
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Power Supply
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2130 W
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Power Supply Type
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AC
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# of Power Supply Included
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2
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Redundant Fans
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Yes
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Redundant Power Supported
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Yes
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Backplanes
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Included
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Included Items
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(1) Intel® Server Chassis H2224XXLR3 (24x2.5" U.2 Drives)
(4) Intel® Server Node HNS2600BPS24 (8) Intel® Xeon® Gold 6140 Processor (18 Cores, 2.3 GHz, 140W ) (64) RDIMM 16GB - DDR4, 288-pin, 2666MHz (4) Intel® Optane™ SSD DC P4800X Series (375GB, 2.5in U.2) (16) Intel® SSD D3 S4510 Series (3.8TB, 2.5in SATA 6Gb/s) (4) 2x10GbE SFP+ and 2x1GbE RDMA (4) Boot Device - Intel® SSD DC P4101 Series (512GB, M.2 80mm PCIe 3.0 x4, 3D2, TLC) (4) Remote Management Module Lite 2 |
Supplemental Information
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Description
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All-Flash with Intel® Optane™ SSD, 144 Cores (36/node), 63.8TB raw capacity, 1TB memory (256GB/node)
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Memory & Storage
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Storage Profile
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All-Flash Storage Profile
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Included Memory
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32X16 GB DDR4 2666MHz
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Memory Types
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RDIMM 16GB - DDR4, 288-pin, 2666MHz
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# of Memory Slots
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64
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Included Storage
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(4) Intel® Optane™ SSD DC P4800X Series (375GB, 2.5in U.2), (16) Intel® SSD DC S4510 Series (3.8TB, 2.5in SATA 6Gb/s)
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# of Front Drives Supported
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24
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Front Drive Form Factor
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Hot-swap 2.5"
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GPU Specifications
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Integrated Graphics ‡
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No
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Expansion Options
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PCIe x16 Gen 3
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8
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I/O Specifications
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# of USB Ports
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8
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Total # of SATA Ports
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32
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Integrated LAN
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Per node: 2 x 10GbE SFP+ (Intel/RDMA)
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Package Specifications
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Max CPU Configuration
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8
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Advanced Technologies
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Intel® Optane™ Memory Supported ‡
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Yes
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Intel® Remote Management Module Support
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Yes
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Integrated BMC with IPMI
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IPMI 2.0
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Intel® Node Manager
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Yes
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Intel® Advanced Management Technology
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Yes
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Intel® Server Customization Technology
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Yes
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Intel® Build Assurance Technology
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Yes
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Intel® Efficient Power Technology
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Yes
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Intel® Quiet Thermal Technology
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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Intel® Rapid Storage Technology enterprise
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Yes
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Intel® Fast Memory Access
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Yes
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Intel® Flex Memory Access
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Yes
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Intel® I/O Acceleration Technology
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Yes
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TPM Version
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2.0
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.