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Essentials

Product Collection
Code Name
Launch Date
Q3'18
Marketing Status
Discontinued
Expected Discontinuance
Q1'19
EOL Announce
Friday, March 8, 2019
Last Order
Friday, March 8, 2019
Last Receipt Attributes
Friday, March 8, 2019
Limited 3-year Warranty
Yes
Chassis Form Factor
2U, 4 node Rack Chassis
Chassis Dimensions
3.46" x 17.24" x 28.86"
Socket
Socket P
TDP
140 W
Heat Sink
(4) 1U passive heat sink – CPU #1 – CuAL – FXXHP78X108HS
(4) 1U passive heat sink – CPU #2 – AL – FXXEA78X108HS
Heat Sink Included
Yes
System Board
Board Chipset
Target Market
Cloud/Datacenter
Rack-Friendly Board
Yes
Power Supply
2130 W
Power Supply Type
AC
# of Power Supply Included
2
Redundant Fans
Yes
Redundant Power Supported
Yes
Backplanes
Included
Included Items
(1) Intel® Server Chassis H2224XXLR3 (24x2.5" U.2 Drives)
(4) Intel® Server Node HNS2600BPS24
(8) Intel® Xeon® Gold 6140 Processor (18 Cores, 2.3 GHz, 140W )
(64) RDIMM 16GB - DDR4, 288-pin, 2666MHz
(4) Intel® Optane™ SSD DC P4800X Series (375GB, 2.5in U.2)
(16) Intel® SSD D3 S4510 Series (3.8TB, 2.5in SATA 6Gb/s)
(4) 2x10GbE SFP+ and 2x1GbE RDMA
(4) Boot Device - Intel® SSD DC P4101 Series (512GB, M.2 80mm PCIe 3.0 x4, 3D2, TLC)
(4) Remote Management Module Lite 2

Supplemental Information

Description
All-Flash with Intel® Optane™ SSD, 144 Cores (36/node), 63.8TB raw capacity, 1TB memory (256GB/node)

Memory & Storage

Storage Profile
All-Flash Storage Profile
Included Memory
32X16 GB DDR4 2666MHz
Memory Types
RDIMM 16GB - DDR4, 288-pin, 2666MHz
# of Memory Slots
64
Included Storage
(4) Intel® Optane™ SSD DC P4800X Series (375GB, 2.5in U.2), (16) Intel® SSD DC S4510 Series (3.8TB, 2.5in SATA 6Gb/s)
# of Front Drives Supported
24
Front Drive Form Factor
Hot-swap 2.5"

GPU Specifications

Integrated Graphics
No

Expansion Options

PCIe x16 Gen 3
8

I/O Specifications

# of USB Ports
8
Total # of SATA Ports
32
Integrated LAN
Per node: 2 x 10GbE SFP+ (Intel/RDMA)

Package Specifications

Max CPU Configuration
8

Advanced Technologies

Intel® Optane™ Memory Supported
Yes
Intel® Remote Management Module Support
Yes
Integrated BMC with IPMI
IPMI 2.0
Intel® Node Manager
Yes
Intel® Advanced Management Technology
Yes
Intel® Server Customization Technology
Yes
Intel® Build Assurance Technology
Yes
Intel® Efficient Power Technology
Yes
Intel® Quiet Thermal Technology
Yes
Intel® Virtualization Technology for Directed I/O (VT-d)
Yes
Intel® Rapid Storage Technology enterprise
Yes
Intel® Fast Memory Access
Yes
Intel® Flex Memory Access
Yes
Intel® I/O Acceleration Technology
Yes
TPM Version
2.0
Product and performance information

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.