Intel® Server System NB2208WFQNFVI
Essentials
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Product Collection
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Code Name
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Launch Date
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Q1'18
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Marketing Status
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Discontinued
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Expected Discontinuance
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Q4'19
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EOL Announce
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Tuesday, October 15, 2019
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Last Order
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Tuesday, October 15, 2019
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Last Receipt Attributes
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Tuesday, October 15, 2019
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Limited 3-year Warranty
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Yes
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Extended Warranty Available for Purchase (Select Countries)
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Yes
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Chassis Form Factor
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2U, Spread Core Rack
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Chassis Dimensions
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16.93" x 27.95" x 3.44"
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Board Form Factor
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Custom 16.7" x 17"
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Rack Rails Included
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No
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Compatible Product Series
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Intel® Xeon® Scalable Processors
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Socket
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Socket P
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TDP
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145 W
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Heat Sink
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(2) FXXCA78X108HS
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Heat Sink Included
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Yes
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System Board
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Board Chipset
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Target Market
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Network Function Virtualization
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Rack-Friendly Board
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Yes
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Power Supply
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1300 W
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Power Supply Type
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AC
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# of Power Supply Included
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1
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Redundant Fans
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Yes
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Redundant Power Supported
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Supported, requires additional power supply
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Backplanes
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Included
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Included Items
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Intel® Server System R2208WFQZS including S2600WFQ board w/symmetric QAT, (2) Intel® Xeon® Gold 6152 CPU, (2 - redundant) 1300W PSU, no embedded networking, R2208WF 2U chassis w/8x2.5” SAS/NVMe drive backplane, (24) 16G RDIMM (DDR4 2666MHz - 384GB total), (4) 25G dual port XXV710-DA2 Networking Adapters, Intel® Ethernet Network Connection OCP I357-T4 (mgmt.), (4)Intel® SSD DC P4500 (1 TB NVMe SSD), (1) AXXP3SWX08040 PCIe Switch adapter, required OCuLink cables for NVMe connectivity, (2) Intel® SSD DC S4500 (240 GB SATA SSD - boot drives), A2UREARHSDK2 rear hotswap drive kit (boot drives), (2) CPU heat sinks FXXCA78X108HS
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Supplemental Information
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Description
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Intel® Data Center Block for Networking (NFVI Server Block) is a pre-configured R2208WFQZS 2U server system. Includes balanced access from both Intel(r) Xeon(r) Gold Scalable processors to the integrated QAT, 25G Networking, and NVMe drives
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Memory & Storage
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Included Memory
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24x 16 GB DDR4 2666MHz (384GB)
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Memory Types
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Registered/Load Reduced DDR4-2133/2400/2666 MHz
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# of Memory Slots
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24
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Included Storage
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4x P4500 1TB SSDs
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# of Front Drives Supported
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8
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Front Drive Form Factor
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Hot-swap 2.5"
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# of Rear Drives Supported
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2
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# of Internal Drives Supported
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4
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GPU Specifications
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Integrated Graphics ‡
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Yes
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Expansion Options
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Connector for Intel® Integrated RAID Module
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1
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Riser Slot 1: Total # of Lanes
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24
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Riser Slot 1: Included Slot Configuration(s)
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3x PCIe Gen3 x8
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Riser Slot 2: Total # of Lanes
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24
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Riser Slot 2: Included Slot Configuration(s)
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3x PCIe Gen3 x8
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Riser Slot 3: Total # of Lanes
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12
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Riser Slot 3: Included Slot Configuration(s)
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1x PCIe Gen3 x8 + 1x PCIe Gen2 x4
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I/O Specifications
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# of USB Ports
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5
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Total # of SATA Ports
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2
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Package Specifications
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Max CPU Configuration
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2
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Advanced Technologies
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Intel® Remote Management Module Support
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Yes
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Integrated BMC with IPMI
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IPMI 2.0 with OEM extensions
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Intel® Node Manager
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Yes
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Intel® On-Demand Redundant Power
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Yes
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Intel® Advanced Management Technology
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Yes
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Intel® Server Customization Technology
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Yes
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Intel® Build Assurance Technology
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Yes
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Intel® Efficient Power Technology
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Yes
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Intel® Quiet Thermal Technology
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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Intel® Rapid Storage Technology enterprise
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Yes
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Intel® Quiet System Technology
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Yes
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.