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Essentials

Product Collection
Code Name
Launch Date
Q1'18
Marketing Status
Discontinued
Expected Discontinuance
Q4'19
EOL Announce
Tuesday, October 15, 2019
Last Order
Tuesday, October 15, 2019
Last Receipt Attributes
Tuesday, October 15, 2019
Limited 3-year Warranty
Yes
Extended Warranty Available for Purchase (Select Countries)
Yes
Chassis Form Factor
2U, Spread Core Rack
Chassis Dimensions
16.93" x 27.95" x 3.44"
Board Form Factor
Custom 16.7" x 17"
Rack Rails Included
No
Compatible Product Series
Intel® Xeon® Scalable Processors
Socket
Socket P
TDP
145 W
Heat Sink
(2) FXXCA78X108HS
Heat Sink Included
Yes
System Board
Board Chipset
Target Market
Network Function Virtualization
Rack-Friendly Board
Yes
Power Supply
1300 W
Power Supply Type
AC
# of Power Supply Included
1
Redundant Fans
Yes
Redundant Power Supported
Supported, requires additional power supply
Backplanes
Included
Included Items
Intel® Server System R2208WFQZS including S2600WFQ board w/symmetric QAT, (2) Intel® Xeon® Gold 6152 CPU, (2 - redundant) 1300W PSU, no embedded networking, R2208WF 2U chassis w/8x2.5” SAS/NVMe drive backplane, (24) 16G RDIMM (DDR4 2666MHz - 384GB total), (4) 25G dual port XXV710-DA2 Networking Adapters, Intel® Ethernet Network Connection OCP I357-T4 (mgmt.), (4)Intel® SSD DC P4500 (1 TB NVMe SSD), (1) AXXP3SWX08040 PCIe Switch adapter, required OCuLink cables for NVMe connectivity, (2) Intel® SSD DC S4500 (240 GB SATA SSD - boot drives), A2UREARHSDK2 rear hotswap drive kit (boot drives), (2) CPU heat sinks FXXCA78X108HS

Supplemental Information

Description
Intel® Data Center Block for Networking (NFVI Server Block) is a pre-configured R2208WFQZS 2U server system. Includes balanced access from both Intel(r) Xeon(r) Gold Scalable processors to the integrated QAT, 25G Networking, and NVMe drives

Memory & Storage

Included Memory
24x 16 GB DDR4 2666MHz (384GB)
Memory Types
Registered/Load Reduced DDR4-2133/2400/2666 MHz
# of Memory Slots
24
Included Storage
4x P4500 1TB SSDs
# of Front Drives Supported
8
Front Drive Form Factor
Hot-swap 2.5"
# of Rear Drives Supported
2
# of Internal Drives Supported
4

GPU Specifications

Integrated Graphics
Yes

Expansion Options

Connector for Intel® Integrated RAID Module
1
Riser Slot 1: Total # of Lanes
24
Riser Slot 1: Included Slot Configuration(s)
3x PCIe Gen3 x8
Riser Slot 2: Total # of Lanes
24
Riser Slot 2: Included Slot Configuration(s)
3x PCIe Gen3 x8
Riser Slot 3: Total # of Lanes
12
Riser Slot 3: Included Slot Configuration(s)
1x PCIe Gen3 x8 + 1x PCIe Gen2 x4

I/O Specifications

# of USB Ports
5
Total # of SATA Ports
2

Package Specifications

Max CPU Configuration
2

Advanced Technologies

Intel® Remote Management Module Support
Yes
Integrated BMC with IPMI
IPMI 2.0 with OEM extensions
Intel® Node Manager
Yes
Intel® On-Demand Redundant Power
Yes
Intel® Advanced Management Technology
Yes
Intel® Server Customization Technology
Yes
Intel® Build Assurance Technology
Yes
Intel® Efficient Power Technology
Yes
Intel® Quiet Thermal Technology
Yes
Intel® Virtualization Technology for Directed I/O (VT-d)
Yes
Intel® Rapid Storage Technology enterprise
Yes
Intel® Quiet System Technology
Yes
Product and performance information

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.