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Intel® Server System R2600SR Family

Intel® Server System LSP2D2ZS568202

Essentials

Product Collection
Code Name
Launch Date
Q1'18
Marketing Status
Discontinued
Expected Discontinuance
Q3'19
EOL Announce
Friday, June 7, 2019
Last Order
Thursday, August 22, 2019
Last Receipt Attributes
Sunday, December 22, 2019
Limited 3-year Warranty
Yes
Chassis Form Factor
2U, 4 node Rack Chassis
Chassis Dimensions
19.3" x 35.1" x 3.5"
Rack Rails Included
Yes
Compatible Product Series
Intel® Xeon® Scalable Processors
Socket
Socket P
TDP
205 W
Heat Sink
8
Heat Sink Included
Yes
System Board
Board Chipset
Target Market
High Performance Computing
Rack-Friendly Board
Yes
Power Supply
2000 W
Power Supply Type
AC
# of Power Supply Included
2
Redundant Fans
Yes
Redundant Power Supported
Yes
Backplanes
Included
Included Items
1) 2U Chassis
(1) Rack Mount Rail Kit
(1) System Management Module (SMM)
(2) 2000WAC Platinum Power Supply Unit (PSU)
(2) Power cords (1.5m, 10A/100-250V,
(4) Intel® Omni-Path Host Fabric Interface Adapter 100 Series 1 Port PCIe x16
(1) 10GB 8-port Ethernet I/O Module (EIOM) Base-T RJ45
(2) 80mm x 80mm x 80mm cooling fans
(3) 60mm x 60mm x 56mm cooling fans
(1) KVM System Console Breakout Cable
(4) Compute Node (includes the following)
•(8) Intel® Xeon® Platinum 8168 Processor
•(4) 105mm CPU1 Heatsink (1 per compute node)
•(4) 85mm CPU 2 Heatsink )
•(8) 4R Heatsink Clips
•(48) 32GB DDR4 2667 RDIMMs
•(4) Intel® SSD DC S4600 Series (1.9TB, 2.5in SATA 6Gb/s)
•(16) Drive Blanks
•(4) VGA/USB KVM
•(4) Node Control Panel

Supplemental Information

Description
2U 4N Intel® Server System R2600SR to support Intel® Xeon® Platinum 8168 processors.

Memory & Storage

Storage Profile
All-Flash Storage Profile
Included Memory
48X32GB DDR4 2666MHz
Memory Types
RDIMM 32GB - DDR4 (2R x 4, 1.2V) 2666MHz
# of Memory Slots
48
Max Memory Size (dependent on memory type)
1.5 TB
DIMM Type
UDIMM, RDIMM, LRDIMM
Included Storage
(4) Intel® SSD DC S4600 (1.9TB )
Max Storage Capacity
7.6 TB
# of Front Drives Supported
4
Front Drive Form Factor
Hot-swap 2.5"

GPU Specifications

Integrated Graphics
Yes

Expansion Options

PCIe x16 Gen 3
4

I/O Specifications

# of USB Ports
4
Total # of SATA Ports
4
USB Configuration
2.0, 3.0 & 3.1
# of Serial Ports
4

Package Specifications

Max CPU Configuration
8

Advanced Technologies

Integrated BMC with IPMI
YES
TPM Version
TPM 2.0
Product and performance information

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.