Essentials
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Product Collection
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Code Name
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Marketing Status
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Discontinued
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Launch Date
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Q1'18
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Expected Discontinuance
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Q2'19
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EOL Announce
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Monday, June 10, 2019
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Last Order
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Friday, August 9, 2019
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Last Receipt Attributes
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Saturday, December 7, 2019
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Limited 3-year Warranty
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Yes
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Extended Warranty Available for Purchase (Select Countries)
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No
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Compatible Product Series
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Intel® Xeon Phi™ Processor 7200 Series
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Board Form Factor
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Custom 6.8" x 14.2"
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Chassis Form Factor
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2U Rack
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Socket
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LGA 3647-1
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Integrated BMC with IPMI
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Emulex Pilot III controller
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Rack-Friendly Board
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Yes
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TDP
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320 W
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Included Items
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(1) – Intel Server Board S7200APR
(3) – System fans (1) – Slot 1 Riser Card (1) – Slot 2 Riser Card (1) – I/O Bridge Board (1) – Power Docking Board (1) – 130mm 2x7 Fan Assembly Cable (1) – 140mm 2x3 Internal Power Cable (1) – Air Duct (1) – Plastic Cover (1) – Liquid Assisted Air Cooling Unit |
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Board Chipset
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Target Market
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High Performance Computing
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Supplemental Information
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Embedded Options Available
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No
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|---|---|
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Description
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Intel® Server S7200APR Product Family provides parallelized workflows in the HPC market, featuring features support for Intel® Xeon® Phi™ processors, with 6 DIMMs (1DPC) and optional support for Intel® Omni Path® Fabric Technology.Liquid air cooled node.
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Memory Specifications
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Max Memory Size (dependent on memory type)
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384 GB
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Memory Types
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Registered DDR4 (RDIMM) and Load Reduced DDR4 (LRDIMM)
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Max # of Memory Channels
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6
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Max Memory Bandwidth
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512 GB/s
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# of Memory Slots
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6
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ECC Memory Supported ‡
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Yes
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GPU Specifications
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Integrated Graphics ‡
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Yes
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|---|---|
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Graphics Output
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Internal RGB Video Header
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Expansion Options
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PCI Express Revision
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3.0
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|---|---|
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Max # of PCI Express Lanes
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32
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PCIe x16 Gen 3
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2
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Riser Slot 1: Total # of Lanes
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16
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Riser Slot 2: Total # of Lanes
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16
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I/O Specifications
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# of USB Ports
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2
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USB Revision
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3.0
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Total # of SATA Ports
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1
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RAID Configuration
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Intel(R) Embedded Server RAID Technology (ESRT2)
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# of Serial Ports
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1
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Integrated LAN
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2) RJ-45 1Gb NIC ports
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Package Specifications
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Max CPU Configuration
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1
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Advanced Technologies
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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No
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Intel® Remote Management Module Support
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Yes
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Intel® Node Manager
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Yes
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Intel® Quick Resume Technology
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Yes
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Intel® Quiet System Technology
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Yes
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Intel® Rapid Storage Technology enterprise
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Yes
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Intel® Fast Memory Access
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Yes
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Intel® Flex Memory Access
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Yes
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Intel® I/O Acceleration Technology
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Yes
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Intel® Advanced Management Technology
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Yes
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Intel® Server Customization Technology
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Yes
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Intel® Build Assurance Technology
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Yes
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Intel® Efficient Power Technology
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Yes
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Intel® Quiet Thermal Technology
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Yes
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TPM Version
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2.0
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Security & Reliability
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Intel® AES New Instructions
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Yes
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|---|---|
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Intel® Trusted Execution Technology ‡
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Yes
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.