Intel® Server System VRN2224BPHY6
Essentials
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Product Collection
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Code Name
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Launch Date
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Q3'18
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Marketing Status
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Discontinued
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Expected Discontinuance
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Q3'19
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EOL Announce
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Monday, July 1, 2019
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Last Order
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Friday, August 30, 2019
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Last Receipt Attributes
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Monday, September 30, 2019
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Limited 3-year Warranty
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Yes
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ISV Certification
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Designed for VMware* Virtual SAN (VSAN)
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Chassis Form Factor
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2U, 4 node Rack Chassis
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Chassis Dimensions
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3.46" x 17.24" x 28.86"
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Board Form Factor
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Custom 6.8" x 19.1"
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Socket
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Socket P
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TDP
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85 W
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Heat Sink
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8
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Heat Sink Included
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Yes
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System Board
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Board Chipset
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Target Market
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Cloud/Datacenter
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Rack-Friendly Board
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Yes
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Power Supply
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2130 W
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Power Supply Type
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AC
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# of Power Supply Included
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2
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Redundant Fans
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No
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Redundant Power Supported
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Yes
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Backplanes
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Included
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Included Items
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(1)Intel® Server Chassis H2224XXLR3
(4)Intel® Compute Module HNS2600BPS24 (4)Intel® Passthrough Bridge Board AHWBPBGB24 (8) Intel® Xeon® Gold 5115 Processor (8)Intel® SSD D3 S4610 Series 2.5" 960GB (4) Intel® SSD DC P4101 256GB M.2. (4)Remote Management Module 4 Lite 2 AXXRMM4LITE2 (16) 2TB SAS HDD 2.5" are customer-supplied and do not ship with Intel(R) DCB (32) RDIMM 32GB - DDR4, 288-pin, 2666MHz. |
Supplemental Information
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Description
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Integrated 2U 4N Hybrid system, certified vSAN Ready Node, Hybrid 6 Profile (HY-6); Intel® Compute Module HNS2600BPS24, Intel® Xeon® Gold 5115 processors.
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Memory & Storage
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Storage Profile
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Hybrid Storage Profile
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Included Memory
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32X32 GB DDR4 2666MHz
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Memory Types
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RDIMM 32GB - DDR4, 288-pin, 2666MHz
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# of Memory Slots
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64
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Max Memory Size (dependent on memory type)
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1 TB
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Included Storage
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(8)Intel® SSD D3 S4610 Series 2.5" 960GB (4) Intel® SSD DC P4101 256GB M.2.
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Max Storage Capacity
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32 TB
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# of Front Drives Supported
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24
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Front Drive Form Factor
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Hot-swap 2.5"
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GPU Specifications
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Integrated Graphics ‡
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No
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Expansion Options
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PCIe x16 Gen 3
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8
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I/O Specifications
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# of USB Ports
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8
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Total # of SATA Ports
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32
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Integrated LAN
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2 x 10GbE SFP+ (Intel/RDMA)
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Package Specifications
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Max CPU Configuration
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8
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Advanced Technologies
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Intel® Optane™ Memory Supported ‡
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Yes
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Intel® Remote Management Module Support
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Yes
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Integrated BMC with IPMI
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IPMI 2.0
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Intel® Node Manager
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Yes
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Intel® Advanced Management Technology
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Yes
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Intel® Server Customization Technology
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Yes
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Intel® Build Assurance Technology
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Yes
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Intel® Efficient Power Technology
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Yes
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Intel® Quiet Thermal Technology
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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Intel® Rapid Storage Technology enterprise
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Yes
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Intel® Fast Memory Access
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Yes
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Intel® Flex Memory Access
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Yes
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Intel® I/O Acceleration Technology
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Yes
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TPM Version
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2.0
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.