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Intel® Server System H2000G Family

Intel® Server System LTP2224JR450600

Essentials

Product Collection
Code Name
Launch Date
Q2'17
Marketing Status
Discontinued
Expected Discontinuance
Q3'20
Limited 3-year Warranty
Yes
Extended Warranty Available for Purchase (Select Countries)
Yes
Chassis Form Factor
2U Rack
Chassis Dimensions
17.24" x 28.86" x 3.42"
Board Form Factor
Custom 6.8" x 18.9"
Socket
Socket R3
Heat Sink
8 (4x2)
Heat Sink Included
Yes
Target Market
Cloud/Datacenter
Rack-Friendly Board
Yes
Power Supply
1600 W
Power Supply Type
AC
# of Power Supply Included
1
Redundant Fans
No
Redundant Power Supported
Yes
Backplanes
Included
Included Items
Intel® Server Chassis H2224XXXKR2 with four Hypervisor Nodes. Each Hypervisor Node includes an Intel® Compute Module HNS2600TP24SR, Intel® Xeon® Processor E5-2650 v4 (x2), 16GB DDR 2400 (x8), Intel® SSD DC P3700 2.5” 400GB (x1) and a Remote Management Module 4 Lite 2 (AXXRMM4LITE2).

Supplemental Information

Description
Cloud Block for OnApp Scale System - Includes four Hypervisor Nodes with Intel Server Board, Chassis, Xeon E5 Processor, Intel Solid State Drives and memory, designed for OnApp and configured to add to a Starter System deployment for additional scaling.

Memory & Storage

Memory Types
DDR4 ECC RDIMM 1600/1866/2133 DDR4 ECC LRDIMM 1600/1866/2133
# of Memory Slots
16
Max Memory Size (dependent on memory type)
1 TB
# of Front Drives Supported
24
Front Drive Form Factor
Hot-swap 2.5"

GPU Specifications

Integrated Graphics
No

Expansion Options

PCIe x8 Gen 3
1
PCIe x16 Gen 3
1

I/O Specifications

# of USB Ports
16
Total # of SATA Ports
24
# of Serial Ports
4
Integrated LAN
4x (2x 1GbE + 2x 10GbE SFP+)
# of LAN Ports
16

Package Specifications

Max CPU Configuration
8

Advanced Technologies

Intel® Remote Management Module Support
Yes
Integrated BMC with IPMI
IPMI 2.0
Intel® Node Manager
Yes
Intel® Advanced Management Technology
Yes
Intel® Server Customization Technology
Yes
Intel® Build Assurance Technology
Yes
Intel® Efficient Power Technology
Yes
Intel® Quiet Thermal Technology
Yes
Intel® Virtualization Technology for Directed I/O (VT-d)
Yes
Intel® Matrix Storage Technology
No
Intel® Quiet System Technology
Yes
Intel® Fast Memory Access
Yes
Intel® Flex Memory Access
Yes
Intel® I/O Acceleration Technology
Yes
TPM Version
2.0
Product and performance information

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.