1. Intel Agilex® 7 M-Series General-Purpose I/O Overview 2. Intel Agilex® 7 M-Series GPIO-B Banks 3. Intel Agilex® 7 M-Series HPS I/O Banks 4. Intel Agilex® 7 M-Series SDM I/O Banks 5. Intel Agilex® 7 M-Series I/O Troubleshooting Guidelines 6. GPIO Intel® FPGA IP 7. Programmable I/O Features Description 8. Documentation Related to the Intel Agilex® 7 General-Purpose I/O User Guide: M-Series 9. Document Revision History for the Intel Agilex® 7 General-Purpose I/O User Guide: M-Series
2.5.1. I/O Standard Placement Restrictions for True Differential I/Os 2.5.2. Placement Restrictions for True Differential and Single-Ended I/O Standards in the Same or Adjacent GPIO-B Bank 2.5.3. VREF Sources and Input Standards Grouping 2.5.4. GPIO-B Pin Restrictions for External Memory Interfaces 2.5.5. RZQ Pin Requirement 2.5.6. I/O Standards Implementation Based on VCCIO_PIO Voltages 2.5.7. I/O Standard Selection and I/O Bank Supply Compatibility Check 2.5.8. Simultaneous Switching Noise 2.5.9. HPS Shared I/O Requirements 2.5.10. Clocking Requirements 2.5.11. SDM Shared I/O Requirements 2.5.12. Unused Pins 2.5.13. VCCIO_PIO Supply for Unused GPIO-B Banks 2.5.14. GPIO-B Pins During Power Sequencing 2.5.15. Drive Strength Requirement for GPIO-B Input Pins 2.5.16. Maximum DC Current Restrictions 2.5.17. 1.05 V, 1.1 V, or 1.2 V I/O Interface Voltage Level Compatibility 2.5.18. Connection to True Differential Signaling Input Buffers During Device Reconfiguration 2.5.19. LVSTL700 I/O Standards Differential Pin Pair Requirements 2.5.20. Implementing a Pseudo Open Drain 2.5.21. Allowed Duration for Using RT OCT 2.5.22. Single-Ended Strobe Signal Differential Pin Pair Restriction
6.1. Release Information for GPIO Intel® FPGA IP 6.2. Generating the GPIO Intel® FPGA IP 6.3. GPIO Intel® FPGA IP Parameter Settings 6.4. GPIO Intel® FPGA IP Interface Signals 6.5. GPIO Intel® FPGA IP Architecture 6.6. Verifying Resource Utilization and Design Performance 6.7. GPIO Intel® FPGA IP Timing 6.8. GPIO Intel® FPGA IP Design Examples
2.5.7. I/O Standard Selection and I/O Bank Supply Compatibility Check
- Select a suitable signaling type and I/O standard for each I/O pin. The I/O banks are located in rows along the top periphery and bottom periphery of the device. Each I/O bank has two sub-banks. Each sub-bank has its own PLL, DPA and SERDES circuitries, and individual VCCIO_PIO voltage rail.
- Ensure that the selected I/O standard is supported in the targeted I/O sub-bank.
- Place I/O pins that share the same VCCIO_PIO voltage levels in the same I/O sub-bank.
- Verify that all output signals in each I/O sub-bank are intended to drive out at the sub-bank's I/O voltage level.
- Verify that all voltage-referenced signals in each I/O lane are intended to use the same VREF source by adhering to the voltage-referenced input standards grouping per I/O lane.
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