AN 875: Intel® Stratix® 10 E-Tile PCB Design Guidelines

ID 683262
Date 3/12/2019
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2.3.2. PCB Materials and Stackup Design

The proper selection of PCB materials and stackup is an essential key in the design flow. There are four key PCB channel design parameters/elements for E-Tile:
  • Insertion Loss (IL)
    • The higher the channel loss, the more difficult it is for devices to send high-speed data over the channel reliably.
    • Different standards have different recommended channel losses.
  • Return Loss (RL)
    • Return Loss (RL) measures how much energy a given channel reflects back. A channel with a high impedance discontinuity will have a bad RL performance (i.e. it will reflect back a lot of energy).
  • Far-End and Near-End Crosstalk (FEXT and NEXT)
    • Crosstalk can be considered a form of noise from neighboring channels. It reduces the noise margin.
  • Mode Conversion (MC)
    • Mode conversion can reduce the common noise cancellation. Common mode noise can leak into the differential mode and reduce the noise margin.