Essentials
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Product Collection
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|---|---|
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Code Name
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Marketing Status
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Discontinued
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Launch Date
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Q4'16
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Expected Discontinuance
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Q4'16
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EOL Announce
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Sunday, January 13, 2019
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Last Order
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Thursday, February 14, 2019
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Last Receipt Attributes
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Sunday, July 14, 2019
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Limited 3-year Warranty
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Yes
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Extended Warranty Available for Purchase (Select Countries)
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Yes
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Additional Extended Warranty Details
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# of QPI Links
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2
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Compatible Product Series
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Intel® Xeon® Processor E5-2600 v4 Family
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Board Form Factor
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Custom 6.8" x 18.9"
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Chassis Form Factor
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Rack
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Socket
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Socket R3
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Integrated Systems Available
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No
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Integrated BMC with IPMI
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2.0
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Rack-Friendly Board
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Yes
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TDP
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145 W
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Included Items
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Integrated compute module includes: (1) Intel® Server Board S2600TPR w/two 1Gb ports (Intel® Ethernet Controller I350 )w/TPM2.0 ; (1) 12Gb/s bridge board (FHWKPTPBGB24); (1) node power board (FH2000NPB24); (1) one slot PCIe x16 riser card (FHW1U16RISER2); (1) front 1U passive heat sinks (FXXEA84X106HS); (1) rear 1U passive heat sink (FXXCA91X91HS); (3) 4056 dual rotor fan (FXX4056DRFAN2); (1) PCI Express* x16 rIOM riser and rIOM carrier board kit (AXXKPTPM2IOM); (1) Dual SFP+ port 10GBASE-T I/O module (AXX10GBNIAIOM); (1) airduct; (1) 1U node tray
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Board Chipset
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Target Market
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Cloud/Datacenter
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Supplemental Information
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Embedded Options Available
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Yes
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|---|---|
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Description
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A hot-pluggable high-density compute module integrated with the Intel® Server Board S2600TPR w/TPM2.0 for higher memory capability and flexible configuration options for the Intel® Server Chassis H2224XXKR2/H2224XXLR2
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Memory Specifications
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Max Memory Size (dependent on memory type)
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1.02 GB
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|---|---|
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Memory Types
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DDR4-1600/1866/2133/2400
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Max # of Memory Channels
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8
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Max Memory Bandwidth
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153.6 GB/s
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Physical Address Extensions
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46-bit
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# of Memory Slots
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16
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ECC Memory Supported ‡
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Yes
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GPU Specifications
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Integrated Graphics ‡
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Yes
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|---|---|
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Graphics Output
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VGA
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Discrete Graphics
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Supported
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Expansion Options
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PCI Express Revision
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3.0
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|---|---|
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Max # of PCI Express Lanes
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64
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PCIe x16 Gen 3
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1
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Connector for Intel® I/O Expansion Module x8 Gen 3
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1
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Riser Slot 1: Total # of Lanes
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16
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Riser Slot 2: Total # of Lanes
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16
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Riser Slot 3: Total # of Lanes
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24
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Riser Slot 4: Total # of Lanes
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16
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I/O Specifications
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# of USB Ports
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4
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USB Revision
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2.0
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Total # of SATA Ports
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6
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# of Serial Ports
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1
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# of LAN Ports
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4
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Integrated LAN
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2x 1GbE + 2x 10GbE SFP+
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Integrated SAS Ports
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6
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Package Specifications
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Max CPU Configuration
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2
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Advanced Technologies
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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|---|---|
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Intel® Remote Management Module Support
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Yes
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Intel® Node Manager
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Yes
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Intel® Fast Memory Access
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Yes
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Intel® Flex Memory Access
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Yes
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Intel® I/O Acceleration Technology
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Yes
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Intel® Advanced Management Technology
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Yes
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Intel® Server Customization Technology
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Yes
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Intel® Build Assurance Technology
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Yes
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Intel® Efficient Power Technology
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Yes
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Intel® Quiet Thermal Technology
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Yes
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TPM Version
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2.0
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Intel® Transparent Supply Chain
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Includes Statement of Conformance and Platform Certificate
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Yes
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Security & Reliability
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Intel® AES New Instructions
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Yes
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|---|---|
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Intel® Trusted Execution Technology ‡
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No
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.