Essentials
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Product Collection
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Code Name
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Processor Included
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Board Number
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NUC6i7KYB
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Supported Operating Systems
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Windows 10, 64-bit*, Windows 8.1, 64-bit*, Windows 7, 64-bit*, Windows Server 2012 R2*, Windows Server 2012*
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Supplemental Information
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Marketing Status
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Discontinued
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Launch Date
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Q2'16
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Warranty Period
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3 yrs
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Embedded Options Available
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No
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Description
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Other features: Includes Thunderbolt 3 (40Gbps) USB 3.1 Gen 2 (10Gbps) and DP 1.2 via USB-C; also includes SDXC card slot
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CPU Specifications
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Total Cores
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4
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Total Threads
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8
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Max Turbo Frequency
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3.50 GHz
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Processor Base Frequency
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2.60 GHz
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Memory & Storage
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Max Memory Size (dependent on memory type)
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32 GB
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|---|---|
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# of Memory Slots
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2
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Memory Types
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DDR4-2133+ 1.2V, 1.35V SO-DIMM
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Max # of Memory Channels
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2
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Max Memory Bandwidth
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34.1 GB/s
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ECC Memory Supported ‡
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No
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Internal Drive Form Factor
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M.2 SSD
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# of Internal Drives Supported
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2
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Removable Memory Card Slot
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SDXC with UHS-I support
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M.2 Card Slot (storage)
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2x 22x42/80
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I/O Specifications
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Graphics Output
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Mini-DP 1.2; HDMI 2.0; USB-C (DP1.2)
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|---|---|
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# of Displays Supported ‡
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3
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# of Thunderbolt™ Ports
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1x Thunderbolt™ 3
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# of USB Ports
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9
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USB Configuration
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2x front and 2x rear USB 3.0, 1x USB 3.1 via Thunderbolt 3; 2x USB 2.0, 2x USB 3.0 via headers
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USB Revision
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2.0, 3.0, 3.1 Gen2
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USB 2.0 Configuration (External + Internal)
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0 + 2
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USB 3.0 Configuration (External + Internal)
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2F, 2R, 2i
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Total # of SATA Ports
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2
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Max # of SATA 6.0 Gb/s Ports
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2
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RAID Configuration
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(2x M.2 SATA or 2x M.2 PCIe) SSD (RAID-0 RAID-1)
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Audio (back channel + front channel)
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7.1 digital; L+R+mic (F); L+R+TOSLINK (R)
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S/PDIF Out Connector
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TOSLINK
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Integrated LAN
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Intel® Ethernet Connection I219-LM
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Wireless Included
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Intel® Dual Band Wireless-AC 8260
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Bluetooth Version
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4.2
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Consumer Infrared Rx Sensor
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Yes
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Additional Headers
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CEC, 2x USB2.0, 2x USB 3.0, FRONT_PANEL
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Expansion Options
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PCI Express Revision
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Gen3
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|---|---|
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PCI Express Configurations ‡
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Dual M.2 slots with PCIe x4 lanes
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Package Specifications
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TDP
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45 W
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|---|---|
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DC Input Voltage Supported
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19 VDC
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Chassis Dimensions
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211 x 116 x 28 mm
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Board Form Factor
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UCFF (4" x 5")
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Advanced Technologies
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Intel® HD Audio Technology
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Yes
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|---|---|
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Intel® Rapid Storage Technology
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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Intel® Virtualization Technology (VT-x) ‡
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Yes
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Security & Reliability
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Intel® Platform Trust Technology (Intel® PTT)
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Yes
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|---|---|
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TPM
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No
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Intel® AES New Instructions
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Yes
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.