Essentials
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Product Collection
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|---|---|
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Code Name
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Launch Date
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Q3'17
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Marketing Status
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Discontinued
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Expected Discontinuance
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Q3'19
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EOL Announce
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Monday, April 22, 2019
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Last Order
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Thursday, August 22, 2019
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Last Receipt Attributes
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Sunday, December 22, 2019
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Limited 3-year Warranty
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Yes
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Extended Warranty Available for Purchase (Select Countries)
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Yes
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Additional Extended Warranty Details
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Chassis Form Factor
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1U, Spread Core Rack
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Chassis Dimensions
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16.93" x 27.95" x 1.72"
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Board Form Factor
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Custom 16.7" x 17"
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Rack Rails Included
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No
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Compatible Product Series
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Intel® Xeon® Scalable Processors
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Socket
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Socket P
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TDP
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165 W
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Heat Sink
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(2) 1U Standard Heat Sink FXXCA78X108HS
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Heat Sink Included
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Yes
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System Board
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Board Chipset
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Target Market
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Full-featured
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Rack-Friendly Board
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Yes
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Power Supply
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1100 W
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Power Supply Type
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AC
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# of Power Supply Included
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1
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Redundant Fans
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No
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Redundant Power Supported
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Supported, requires additional power supply
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Backplanes
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Included
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Included Items
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(1) Intel® Server Board S2600WFT (Dual 10GbE LAN) S2600WFT, (2) Riser card assembly with 1 slot PCIe x16 riser card F1UL16RISER3, (4) 3.5” Hot-swap drive bays with drive carriers and drive blanks: Includes (1) 12 Gb SAS backplane FR1304S3HSBP, (4) 3.5” hot swap drive tool less carriers FXX35HSCAR2, (1) Standard control panel assembly FXXFPANEL2, (1) Front I/O Panel assembly (VGA and 2 x USB), (1) 150mm Backplane I2C cable, (1) 850mm MiniSAS HD Cable AXXCBL850HDHRT, (1) 350mm Backplane power cable, (1) Air duct, (6) Dual rotor system fans FR1UFAN10PW, (8) DIMM slot blanks, (1) Chassis Stiffener Bar, (1) 1100W power supply module AXX1100PCRPS, (2) CPU heat sinks FXXCA78X108HS, (2) CPU heat sink “No CPU” Label inserts, (2) Standard CPU Carrier, (1) Power supply bay blank insert, (2) Chassis handle (1 set) installed A2UHANDLKIT3, (2) AC Power Cord retention strap assembly
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Supplemental Information
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Description
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Integrated 1U system featuring an Intel® Server Board S2600WFT with Dual 10GbE LAN, four 3.5 inch hot-swap drives, 24 DIMMs, one 1100W redundant-capable power supply, Intel® OCP Module for adding additional features without losing a PCIe add-in slot
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Memory & Storage
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Memory Types
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Registered/Load Reduced DDR4-2133/2400/2666 MHz
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|---|---|
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# of Memory Slots
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24
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Max Memory Size (dependent on memory type)
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1.5 TB
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# of Front Drives Supported
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4
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Front Drive Form Factor
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Hot-swap 3.5" HDD or 2.5" SSD
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# of Internal Drives Supported
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2
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Internal Drive Form Factor
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M.2 SSD
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Expansion Options
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PCIe x24 Riser Super slot
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2
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|---|---|
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Connector for Intel® I/O Expansion Module x8 Gen 3
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1
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Connector for Intel® Integrated RAID Module
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1
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Riser Slot 1: Total # of Lanes
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24
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Riser Slot 1: Included Slot Configuration(s)
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1x PCIe Gen3 x16
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Riser Slot 2: Total # of Lanes
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24
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Riser Slot 2: Included Slot Configuration(s)
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1x PCIe Gen3 x16
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I/O Specifications
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# of USB Ports
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5
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|---|---|
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Total # of SATA Ports
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10
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RAID Configuration
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SW RAID 0, 1, 10, optional 5
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# of Serial Ports
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2
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Integrated LAN
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2x 10GbE
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# of LAN Ports
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2
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Optical Drive Support
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Yes
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Package Specifications
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Max CPU Configuration
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2
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Advanced Technologies
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Intel® Optane™ Memory Supported ‡
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Yes
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|---|---|
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Intel® Remote Management Module Support
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Yes
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Integrated BMC with IPMI
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IPMI 2.0 & Redfish
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Intel® Node Manager
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Yes
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Intel® On-Demand Redundant Power
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Yes
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Intel® Advanced Management Technology
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Yes
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Intel® Server Customization Technology
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Yes
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Intel® Build Assurance Technology
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Yes
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Intel® Efficient Power Technology
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Yes
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Intel® Quiet Thermal Technology
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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Intel® Rapid Storage Technology enterprise
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Yes
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Intel® Quiet System Technology
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Yes
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Intel® Fast Memory Access
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Yes
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Intel® Flex Memory Access
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Yes
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TPM Version
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2.0 (optional module)
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Intel® Transparent Supply Chain
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Includes Statement of Conformance and Platform Certificate
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Yes
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.