Intel® Server System R2208WTTYC1
Essentials
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Product Collection
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Code Name
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Launch Date
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Q1'15
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Marketing Status
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Discontinued
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Expected Discontinuance
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Q1'16
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EOL Announce
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Friday, November 13, 2015
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Last Order
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Friday, January 29, 2016
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Last Receipt Attributes
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Friday, February 26, 2016
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Limited 3-year Warranty
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Yes
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Extended Warranty Available for Purchase (Select Countries)
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Yes
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Additional Extended Warranty Details
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Chassis Form Factor
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2U Rack
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Chassis Dimensions
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16.93" x 27.95" x 3.44"
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Board Form Factor
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Custom 16.7" x 17"
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Rack Rails Included
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No
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Compatible Product Series
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Intel® Xeon® Processor E5-2600 v3 Family
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Socket
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Socket R3
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TDP
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145 W
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Heat Sink
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2
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Heat Sink Included
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Yes
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System Board
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Target Market
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Cloud/Datacenter
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Rack-Friendly Board
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Yes
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Power Supply
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1100 W
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Power Supply Type
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AC
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# of Power Supply Included
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2
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Redundant Fans
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Yes
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Redundant Power Supported
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Yes
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Backplanes
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Included
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Included Items
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(1) Intel® Server Board S2600WTT in a 2U chassis, (1) front 1x VGA and 2x USB on a dedicated tray, (1) airduct for passive Intel® Xeon Phi™ Coprocessor cards AWTCOPRODUCT, (1) standard control panel board FXXFPANEL, (1) ODD bay for CD/DVD drive support, (8) 2.5 inch hot-swap drive carriers FXX8X25S3HSBP, (1) backplane FXX8X25S3HSBP, (2) AXXCBL730HRHD cables, (2) processor heatsinks FXXCA84X106HS, (6) redundant and hot-swap cooling fans, (2) risers with 1x16 and 1x8 PCIe* 3.0 slots each A2UL18RISER2, (1) riser with 1x8 PCIe* 3.0 and 1x4 PCIe* 2.0 slot A2UX8X4RISER, (2) power cables A2UL16RISER2, (1) Intel® Xeon Phi™ Coprocessor mounting/shipping bracket, , (1) battery backup unit bracket with three mounting locations over the airduct, and (2) 1100W AC power supply AXX1100PCRPS
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Supplemental Information
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Description
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Integrated 2U system, optimized for Intel® Visual Compute Accelerator and Intel® Xeon Phi™ coprocessor, with Intel® Server Board S2600WTT, (8) 2.5 inch hot-swap drives, dual 10-GbE LAN, 24 DIMMs, (2) 1100W redundant power
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Memory & Storage
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Memory Types
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DDR4-1600/1866/2133
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# of Memory Slots
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24
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Max Memory Size (dependent on memory type)
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1.5 TB
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# of Front Drives Supported
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8
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Front Drive Form Factor
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Hot-swap 2.5"
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GPU Specifications
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Integrated Graphics ‡
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Yes
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Expansion Options
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PCIe x4 Gen 3
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1
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PCIe x8 Gen 3
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3
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PCIe x16 Gen 3
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2
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PCIe x4 Gen 2.x
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1
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Connector for Intel® I/O Expansion Module x8 Gen 3
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1
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Connector for Intel® Integrated RAID Module
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1
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I/O Specifications
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# of USB Ports
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5
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Total # of SATA Ports
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10
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RAID Configuration
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SW RAID 0, 1, 10, optional 5
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# of Serial Ports
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2
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Integrated LAN
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2x 10-GbE
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# of LAN Ports
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2
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Optical Drive Support
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Yes
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Firewire
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No
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Integrated SAS Ports
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0
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Embedded USB (eUSB) Solid State Drive Option
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Yes
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Integrated InfiniBand*
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No
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Package Specifications
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Max CPU Configuration
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2
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Advanced Technologies
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Intel® Remote Management Module Support
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Yes
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Integrated BMC with IPMI
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IPMI 2.0 with OEM extensions
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Intel® Node Manager
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Yes
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Intel® On-Demand Redundant Power
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Yes
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Intel® Advanced Management Technology
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Yes
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Intel® Server Customization Technology
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Yes
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Intel® Build Assurance Technology
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Yes
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Intel® Efficient Power Technology
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Yes
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Intel® Quiet Thermal Technology
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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Intel® Matrix Storage Technology
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No
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Intel® Rapid Storage Technology
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No
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Intel® Rapid Storage Technology enterprise
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Yes
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Intel® Quiet System Technology
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Yes
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Intel® Fast Memory Access
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Yes
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Intel® Flex Memory Access
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Yes
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Intel® I/O Acceleration Technology
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Yes
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TPM Version
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1.2
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.