Intel® Server System M50FCP2UR312
Essentials
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Product Collection
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Code Name
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Launch Date
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Q1'23
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Marketing Status
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Discontinued
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Expected Discontinuance
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2023
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EOL Announce
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Friday, May 5, 2023
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Last Order
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Friday, June 30, 2023
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Limited 3-year Warranty
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Yes
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Extended Warranty Available for Purchase (Select Countries)
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Yes
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Chassis Form Factor
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2U Rack
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Chassis Dimensions
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770 x 438 x 87 mm
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Board Form Factor
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18.79” x 16.84”
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Rack Rails Included
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No
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Compatible Product Series
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4th Gen Intel® Xeon® Scalable Processors, 5th Gen Intel® Xeon® Scalable Processors
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Socket
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Socket-E LGA4677
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TDP
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250 W
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Heat Sink Included
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No
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System Board
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Board Chipset
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Rack-Friendly Board
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Yes
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Power Supply
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2100 W
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Power Supply Type
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AC
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# of Power Supply Included
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0
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Redundant Fans
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Yes
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Redundant Power Supported
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Supported, requires additional power supply
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Backplanes
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Included
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Included Items
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(1) – 2U 3.5" chassis – iPN M36819-xxx
(1) – Server board – iPC M50FCP2SBSTD (1) 12 x 3.5" combo HSBP – iPC CYPHSBP2312 (12) 3.5" HDD/SSD drive carriers – iPN J36447-xxx (1) HSBP power cable – iPN K67596-xxx (1) I2C cable, server board to HSBP – iPN K63231-xxx (2) – Riser card assembly brackets (1) – Front panel (left) with two USB ports – iPN K48177-xxx (1) – Front Panel (left) USB cable – iPN K67061-xxx (1) – Front panel (right) with control panel – iPN K48178-xxx (1) – Front panel (right) cable pin – iPN K67059-xxx (6) – Single-rotor system fans – iPC CYPFAN2UKIT (16) – DIMM blanks – iPN M45676-xxx (1) – Standard 2U air duct (for 2U-Tall HS) – iPC FCPDUCTSTD (2) – Intel® RAID Maintenance Free Backup Unit (RMFBU) bracket (2) – E1A (XCC) processor clips – iPN AXXSPRXCCCC (2) - E1B (MCC) processor clips - iPN AXXSPRMCCCC NOTE: NO PSU included |
Supplemental Information
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Description
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Integrated 2U system featuring an Intel® Server Board M50FCP2SBSTD,
supporting two 4th Generation Intel® Xeon® Scalable processors, (12) 3.5" HDD with air cooling. NOTE: NO PSU included |
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Memory & Storage
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Memory Types
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• DDR5 (RDIMM)
• 3DS-RDIMM • 9x4 RDIMM • Intel® Optane™ PMem 300 series |
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# of Memory Slots
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32
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Max Memory Size (dependent on memory type)
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12 TB
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# of Front Drives Supported
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12
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Intel® Optane™ Persistent Memory Supported
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Yes
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GPU Specifications
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Integrated Graphics ‡
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Yes
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Expansion Options
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PCI Express Revision
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5.0
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Riser Slot 1: Total # of Lanes
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32
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Riser Slot 2: Total # of Lanes
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32
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Riser Slot 3: Total # of Lanes
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16
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I/O Specifications
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Open Compute Port (OCP) Support
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1 x 3.0
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# of USB Ports
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5
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Total # of SATA Ports
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10
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USB Configuration
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• One USB 3.0 port at back panel
• Two USB 2.0 ports at back panel • One USB 3.0 port front panel • One USB 2.0 port front panel |
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Max # of UPI Links
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3
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RAID Configuration
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0/1/5/10
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# of Serial Ports
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1
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Package Specifications
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Max CPU Configuration
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2
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Advanced Technologies
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Advanced System Management key
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Yes
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Intel® Optane™ Memory Supported ‡
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Yes
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Intel® Remote Management Module Support
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Yes
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Integrated BMC with IPMI
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IPMI 2.0 & Redfish
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Intel® Node Manager
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Yes
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Intel® Advanced Management Technology
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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TPM Version
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2.0
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Security & Reliability
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Intel® Total Memory Encryption
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Yes
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Intel® Trusted Execution Technology ‡
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Yes
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.