Intel® Server System M50CYP2UR208
Essentials
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Product Collection
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Code Name
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Launch Date
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Q2'21
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Marketing Status
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Discontinued
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Expected Discontinuance
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2023
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EOL Announce
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Friday, May 5, 2023
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Last Order
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Friday, June 30, 2023
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Limited 3-year Warranty
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Yes
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Extended Warranty Available for Purchase (Select Countries)
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Yes
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Additional Extended Warranty Details
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Chassis Form Factor
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2U Rack
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Chassis Dimensions
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770 x 446 x 87 mm
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Board Form Factor
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18.79” x 16.84”
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Rack Rails Included
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No
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Compatible Product Series
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3rd Generation Intel® Xeon® Scalable Processors
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Socket
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Socket-P4
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TDP
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270 W
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Heat Sink Included
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No
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System Board
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Board Chipset
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Target Market
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Mainstream
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Rack-Friendly Board
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Yes
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Power Supply
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2100 W
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Power Supply Type
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AC
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# of Power Supply Included
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0
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Redundant Fans
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Yes
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Redundant Power Supported
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Supported, requires additional power supply
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Backplanes
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Included
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Included Items
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(1) 2U 2.5” Chassis with Quick Reference Label affixed to top cover - iPN K52544
(1) Intel® Server Board M50CYP2SBSTD (12) 2.5” hot-swap drive bays with drive mounting rails and blanks - iPN K53035 (1) Front I/O assembly w/ two USB ports, left side -K48177 (1) Front control panel (right) with control/status buttons -iPN K48178 (1) 2U Hot-swap backplane spare CYPHSBP2208 (16) DIMM Blank –iPN K91058 (1) Splitter power cable, server board connector to HSBP (1, 2, and 3) 2x6 to 3i_2x2- 455/565/720 mm – iPN K62572 (1) I2C cable, server board to- 350 mm –iPN K63232 (1) 2U Standard Air duct – iPN K52571 (6) 2U Spare Fan Kit CYPFAN2UKIT (2) Processor carrier clip -iPN J98484 NOTE: NO PSU included |
Memory & Storage
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Memory Types
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-DDR4 (RDIMM)
-3DS-RDIMM -Load Reduced DDR4 (LRDIMM) -3DS-LRDIMM -Intel® Optane™ persistent memory 200 series |
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# of Memory Slots
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32
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Max Memory Size (dependent on memory type)
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12 TB
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# of Front Drives Supported
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24
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Front Drive Form Factor
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Hot-Swap 2.5" SSD
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Intel® Optane™ Persistent Memory Supported
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Yes
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GPU Specifications
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Integrated Graphics ‡
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Yes
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Expansion Options
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Riser Slot 1: Total # of Lanes
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32
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Riser Slot 2: Total # of Lanes
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32
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Riser Slot 3: Total # of Lanes
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16
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I/O Specifications
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Open Compute Port (OCP) Support
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1 x 3.0
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# of USB Ports
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6
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Total # of SATA Ports
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10
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USB Configuration
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•Three USB 3.0 on the back panel
•One USB 3.0 + one USB 2.0 on the front panel •One USB 2.0 internal Type-A |
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Max # of UPI Links
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3
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# of Serial Ports
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2
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Integrated SAS Ports
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8
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Package Specifications
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Max CPU Configuration
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2
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Advanced Technologies
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Advanced System Management key
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Yes
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Intel® Optane™ Memory Supported ‡
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Yes
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Intel® Remote Management Module Support
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Yes
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Integrated BMC with IPMI
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IPMI 2.0 & Redfish
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Intel® Node Manager
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Yes
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Intel® Advanced Management Technology
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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TPM Version
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2.0
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Security & Reliability
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Intel® Trusted Execution Technology ‡
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Yes
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.