Essentials
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Product Collection
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Code Name
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Marketing Status
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Discontinued
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Launch Date
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Q2'21
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Expected Discontinuance
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2023
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EOL Announce
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Friday, May 5, 2023
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Last Order
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Friday, June 30, 2023
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Limited 3-year Warranty
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Yes
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Extended Warranty Available for Purchase (Select Countries)
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Yes
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Additional Extended Warranty Details
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Compatible Product Series
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3rd Generation Intel® Xeon® Scalable Processors
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Board Form Factor
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18.79” x 16.84”
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Chassis Form Factor
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Rack
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Socket
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Socket-P4
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Integrated BMC with IPMI
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IPMI 2.0 & Redfish
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Rack-Friendly Board
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Yes
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TDP
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270 W
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Included Items
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(1) Intel® Server Board M50CYP2SB1U
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Board Chipset
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Target Market
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Mainstream
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Supplemental Information
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Embedded Options Available
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No
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|---|---|
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Description
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Spreadcore form factor board supporting two Xeon® SP 270W TDP processors, 16 DIMMs w/ 8x Intel® Optane™ PMM capable DIMMs per CPU.
Support for EVAC heat sink |
Memory Specifications
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Max Memory Size (dependent on memory type)
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12 TB
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|---|---|
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Memory Types
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-DDR4 (RDIMM)
-3DS-RDIMM -Load Reduced DDR4 (LRDIMM) -3DS-LRDIMM -Intel® Optane™ persistent memory 200 series |
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Max # of Memory Channels
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16
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Max Memory Bandwidth
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3200 GB/s
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# of Memory Slots
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32
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ECC Memory Supported ‡
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Yes
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Intel® Optane™ Persistent Memory Supported
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Yes
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GPU Specifications
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Integrated Graphics ‡
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Yes
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|---|---|
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Graphics Output
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VGA
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Expansion Options
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PCI Express Revision
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4.0
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|---|---|
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Riser Slot 1: Total # of Lanes
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32
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Riser Slot 2: Total # of Lanes
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32
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Riser Slot 3: Total # of Lanes
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16
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I/O Specifications
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Open Compute Port (OCP) Support
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1 x 3.0
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|---|---|
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# of USB Ports
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6
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USB Configuration
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• Three external USB 3.0 on back panel
• One USB 3.0 port front panel • One USB 2.0 port front panel • One USB 2.0 internal Type-A |
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USB Revision
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2.0 & 3.0
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Total # of SATA Ports
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10
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Max # of UPI Links
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3
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RAID Configuration
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0/1/5/10
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# of Serial Ports
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2
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Package Specifications
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Max CPU Configuration
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2
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|---|
Advanced Technologies
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Advanced System Management key
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Yes
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|---|---|
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Intel® Optane™ Memory Supported ‡
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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Intel® Remote Management Module Support
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Yes
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Intel® Node Manager
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Yes
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Intel® Advanced Management Technology
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Yes
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TPM Version
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2.0
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Security & Reliability
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Intel® Trusted Execution Technology ‡
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Yes
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.