Intel® Server Board M70KLP2SB
Essentials
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Product Collection
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Code Name
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Marketing Status
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Discontinued
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Launch Date
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Q1'21
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Expected Discontinuance
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2022
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EOL Announce
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Monday, March 7, 2022
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Last Order
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Friday, May 6, 2022
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Last Receipt Attributes
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Tuesday, July 5, 2022
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Limited 3-year Warranty
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Yes
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Compatible Product Series
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3rd Generation Intel® Xeon® Scalable Processors
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Board Form Factor
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610mm x 424mm, Thickness 2.34mm
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Chassis Form Factor
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2U Rack
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Socket
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P+
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Integrated BMC with IPMI
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IMPI 2.0 & Red Fish
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Rack-Friendly Board
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Yes
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TDP
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250 W
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Included Items
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(1) Intel® Server Board M70KLP2SB
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Board Chipset
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Target Market
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Mainstream
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Supplemental Information
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Embedded Options Available
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No
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Description
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Four socket system board for use in the 2U Intel® Server System M70KLP featuring 3rd Generation Intel® Xeon® processors.
Optimized for scale-up or scale-out consolidation use cases. |
Memory Specifications
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Max Memory Size (dependent on memory type)
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6 TB
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Memory Types
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DDR4 SDRAM DIMMs
15 TB with Intel® Optane™ Persistent Memory |
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Max # of Memory Channels
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24
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# of Memory Slots
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48
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Intel® Optane™ Persistent Memory Supported
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Yes
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Expansion Options
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PCI Express Revision
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PCIe 3.0
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Max # of PCI Express Lanes
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176
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PCIe x8 Gen 3
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4
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PCIe x16 Gen 3
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2
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PCIe Slimline Connectors
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8x8
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Connector for Intel® Integrated RAID Module
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1
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Riser Slot 1: Total # of Lanes
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16
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Riser Slot 2: Total # of Lanes
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16
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I/O Specifications
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Open Compute Port (OCP) Support
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1x3.0
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# of USB Ports
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4
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USB Configuration
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(3) USB 3.0 ports
(1) USB 2.0 port |
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USB Revision
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3.0
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Total # of SATA Ports
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2
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Max # of UPI Links
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6
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RAID Configuration
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1, 5, 6, and 10
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# of Serial Ports
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2
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Package Specifications
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Max CPU Configuration
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4
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Advanced Technologies
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Advanced System Management key
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Yes
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TPM Version
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2.0
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.