Intel® Server System M20MYP1UR
Essentials
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Product Collection
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Code Name
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Launch Date
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Q2'20
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Marketing Status
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Discontinued
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Expected Discontinuance
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2023
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EOL Announce
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Thursday, April 7, 2022
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Last Order
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Friday, July 1, 2022
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Last Receipt Attributes
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Wednesday, August 31, 2022
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Limited 3-year Warranty
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Yes
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Extended Warranty Available for Purchase (Select Countries)
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Yes
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Chassis Form Factor
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1U Rack
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Chassis Dimensions
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660 x 438.5 x 43.2 mm (26” x 17.2” x 1.7”)
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Board Form Factor
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SSI EEB (12 x 13 in)
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Compatible Product Series
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2nd Generation Intel® Xeon® Scalable Processors
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Socket
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Socket P
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TDP
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150 W
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Heat Sink
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(2) AXXSTPHMKIT1U
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Heat Sink Included
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Yes
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System Board
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Board Chipset
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Target Market
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Cloud/Datacenter
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Rack-Friendly Board
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Yes
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Power Supply
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750 W
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Power Supply Type
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AC
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# of Power Supply Included
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1
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Backplanes
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Included
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Included Items
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(1) Intel® Server Chassis M20MYP
(1) Intel® Server Board MYP1USVB (2) 1U PCIe x16 Riser Card MYP1URISER (1) 12 Gb SAS backplane FR1304S3HSBP (4) 3.5” hot swap drive tool less carriers FXX35HSCAR2 (1) Pre-installed control panel (1) 350 mm backplane I2C cable J20956 -xxx (1) Mini SAS HD cable AXXCBL650HDHD (1) Backplane power cable (1) 1U Server airduct MYP1UADUCT (6) 40 x 28 mm managed system fans (1) 750W power supply module FXX750PCRPS (2) CPU passive heat sinks, 51 fins AXXSTPHMKIT1U (2) CPU heat sink “No CPU” label inserts (2) Standard CPU Carriers H72853 -xxx |
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Use Conditions
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Server/Enterprise
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Supplemental Information
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Description
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Integrated 1U system featuring an Intel® Server Board MYP1USVB, supporting two 2nd Generation Intel® Xeon® Scalable processors.
Dual CPU support up to 150W TDP. Up to 165W for specific single CPU configurations. |
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Memory & Storage
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Storage Profile
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Hybrid Storage Profile
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Memory Types
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DDR4 RDIMM/LRDIMM, Up to 2933 MT/s, 1.2 V
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# of Memory Slots
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16
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Max Memory Size (dependent on memory type)
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512 GB
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# of Front Drives Supported
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4
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Front Drive Form Factor
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Hot-swap 2.5" or 3.5"
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# of Internal Drives Supported
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2
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Internal Drive Form Factor
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M.2 SSD
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Expansion Options
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PCIe x16 Gen 3
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2
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Riser Slot 1: Total # of Lanes
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16
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Riser Slot 1: Included Slot Configuration(s)
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1x PCIe Gen3 x16
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Riser Slot 2: Total # of Lanes
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16
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Riser Slot 2: Included Slot Configuration(s)
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1x PCIe Gen3 x16
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I/O Specifications
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# of USB Ports
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7
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Total # of SATA Ports
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6
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USB Configuration
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Two USB 2.0 ports on back panel
Two USB 3.0 ports on back panel One internal USB 3.0 type-A connector Two USB 3.0 ports on front panel |
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Max # of UPI Links
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2
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RAID Configuration
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0,1,5,10
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# of Serial Ports
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1
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Integrated LAN
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Yes
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# of LAN Ports
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2
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Package Specifications
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Max CPU Configuration
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2
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Advanced Technologies
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Intel® Remote Management Module Support
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Yes
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Integrated BMC with IPMI
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IPMI 2.0
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Intel® Node Manager
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Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
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Yes
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Intel® Rapid Storage Technology enterprise
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Yes
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TPM Version
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2.0
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Product and performance information
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.