Intel® Stratix® 10 MX FPGA is the essential multi-function accelerator for high-performance computing (HPC), data center, virtual networking functions (NFV), and broadcast applications.
Heterogeneous system-in-package (SiP) products combine the flexibility of an FPGA with various advanced components in a highly integrated package.
Heterogeneous system-in-package (SiP) products are highly integrated semiconductors that combine FPGAs with various advanced components, all within a single package. FPGA-based SiP products address next-generation platforms, which are increasingly requiring higher bandwidth, increased flexibility and increased functionality, all while lowering power profiles and footprint requirements.
An FPGA-based SiP approach provides many system-level advantages compared to conventional integration schemes.
Heterogeneous SiP products are highly integrated semiconductors. At the core of Intel's SiP products is a monolithic FPGA, which provides users the ability to customize and differentiate their end system to meet their system requirements. Additional system-level benefits include:
An innovative Embedded Multi-Die Interconnect Bridge (EMIB) packaging technology, developed by Intel, enables effective in-package integration of system-critical components such as analog, memory, ASICs, CPU, etc. EMIB offers a simpler manufacturing flow compared to other in-package integration technologies. EMIB eliminates the use of through silicon vias (TSV) and specialized interposer silicon. The result is highly integrated, system-in-package products that offer higher performance, less complexity, and superior signal and power integrity. Additional information about Intel’s EMIB technology can be found on the Intel Custom Foundry website located at http://www.intel.com/content/www/us/en/foundry/emib.html
Intel's near memory solutions integrate high-density DRAM close to the FPGA, within the same package. In this configuration, the in-package memory is accessible significantly faster, up to 10X higher bandwidth when compared to traditional main memory. A near-memory configuration also reduces system power by reducing traces between the FPGA and memory, while also reducing board area.
DRAM system-in-package (SiP) solutions leverage high-bandwidth memory 2 (HBM2) to eliminate memory bandwidth bottlenecks in high-performance systems that are processing an ever-increasing amount of data; including data center, broadcast, wireline networking, and high-performance computing systems.
HBM2 DRAM is a 3D memory that vertically stacks multiple DRAM die using through silicon via (TSV) technology. Compared to discrete DDR-based solutions, HBM2 DRAM provides higher memory bandwidth, lower system power, and smaller form factor, thereby providing the best bandwidth/watt.
Intel® Stratix® 10 MX devices integrate HBM2 tiles alongside a high-performance monolithic 14 nm FPGA die to offer over 10X higher memory bandwidth relative to discrete DRAM solutions.
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