Agilex™ 5 FPGA E-Series 065B Modular Development Kit User Guide

ID 820977
Date 8/14/2025
Public
Document Table of Contents

1.2. Feature Summary

  • Agilex™ 5 E-Series A5E065X device in 32 mm × 32 mm, 1591B package
    • Dual core Arm* Cortex* -A76, Dual core Arm* Cortex* -A55
    • 65K logic elements
    • High-voltage I/O (HVIO)-120 (6 banks)
    • High-speed I/O (HSIO)-384 (IO96B, 4 banks)
    • Low-voltage differential signaling (LVDS)-192 (IO96B)
    • Transceivers-24 (6 banks, 4 lane each)
  • FPGA configuration:
    • 2 Gb flash for Active Serial (AS) x4 configuration mode
    • JTAG header for device programming
    • Built-in Altera® FPGA Download Cable II for device programming
  • Programmable clock sources
  • Transceiver (XCVR) interfaces:
  • Memory interfaces:
    • 1x 8GB DDR4-1600 (x32 without ECC) for fabric I/O memory on Bank 2B
    • 1x 8GB DDR4-1600 (x32 with ECC) for fabric I/O memory on Bank 3B
    • 1x 8GB DDR4-1600 (x32 with ECC) for HPS processor memory on Bank 3A
  • Other interfaces:
    • IO48 interface for HPS
    • 8 channel MIPI interface to high-speed I/Os (HSIO) bank
  • Mechanical
    • Modular board: 113 mm × 94 mm × 1.6 mm
    • Carrier board: 255 mm × 111 mm × 1.6 mm
    • Active heatsink solution for FPGA
  • Operating environment:
    • Maximum ambient temperature of 0°C–30°C