High Bandwidth Memory (HBM2E) Interface Intel Agilex® 7 M-Series FPGA IP User Guide

ID 773264
Date 7/14/2023

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2.1. HBM2E in Intel Agilex® 7 M-Series Devices

Intel Agilex® 7 M-Series devices incorporate a high-performance FPGA fabric along with two HBM2E memory DRAMs in a single package. Intel Agilex® 7 M-Series devices support up to a maximum of two HBM2E interfaces.

Intel Agilex® 7 M-Series devices incorporate Intel’s Embedded Multi-Die Interconnect Bridge (EMIB) technology to implement a silicon bridge between HBM2E DRAM memory and the Universal Interface Block Subsystem (UIBSS). The UIB subsystem contains the HBM2E controller (HBMC), physical-layer interface (PHY), and I/O ports to interface to the HBM2E stack. The FPGA core accesses the UIB through the integrated hard memory network-on-chip (NoC).

As illustrated in the figure below, each Intel Agilex® 7 M-Series device contains a single universal interface bus per HBM2E interface, supporting 8 independent channels. The HBM2E channel interface operates in pseudo-channel mode, providing a separate read and write command queue for each of the two pseudo-channels.

The user interface to the hard memory NoC uses the AXI4 protocol; the hard memory NoC also communicates with the UIB using the AXI4 protocol. Each HBM2E controller provides sixteen AXI interfaces, one AXI interface for each HBM2E pseudo-channel. HBM2E DRAM densities of 8GB and 16GB are supported.

Figure 1.  Intel Agilex® 7 M-Series Device with Hard Memory NoC, UIB, and HBM2E DRAM