MAX® 10 High-Speed LVDS I/O User Guide

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ID 683760
Date 3/10/2025
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Document Table of Contents
Document Table of Contents x
1. MAX® 10 High-Speed LVDS I/O Overview 2. MAX® 10 High-Speed LVDS Architecture and Features 3. MAX® 10 LVDS Transmitter Design 4. MAX® 10 LVDS Receiver Design 5. MAX® 10 LVDS Transmitter and Receiver Design 6. MAX® 10 High-Speed LVDS Board Design Considerations 7. Soft LVDS Intel® FPGA IP Core References 8. MAX® 10 High-Speed LVDS I/O User Guide Archives 9. Document Revision History for the MAX® 10 High-Speed LVDS I/O User Guide
1. MAX® 10 High-Speed LVDS I/O Overview x
1.1. Soft LVDS Implementation Overview
2. MAX® 10 High-Speed LVDS Architecture and Features x
2.1. MAX® 10 LVDS Channels Support 2.2. MAX® 10 LVDS SERDES I/O Standards Support 2.3. MAX® 10 High-Speed LVDS Circuitry 2.4. MAX® 10 High-Speed LVDS I/O Location 2.5. Differential I/O Pins in Low Speed Region
3. MAX® 10 LVDS Transmitter Design x
3.1. High-Speed I/O Transmitter Circuitry 3.2. LVDS Transmitter Programmable I/O Features 3.3. LVDS Transmitter I/O Termination Schemes 3.4. LVDS Transmitter FPGA Design Implementation 3.5. LVDS Transmitter Debug and Troubleshooting
3.2. LVDS Transmitter Programmable I/O Features x
3.2.1. Programmable Pre-Emphasis 3.2.2. Programmable Differential Output Voltage
3.3. LVDS Transmitter I/O Termination Schemes x
3.3.1. Emulated LVDS External Termination 3.3.2. Sub-LVDS Transmitter External Termination 3.3.3. SLVS Transmitter External Termination 3.3.4. Emulated RSDS, Emulated Mini-LVDS, and Emulated PPDS Transmitter External Termination
3.4. LVDS Transmitter FPGA Design Implementation x
3.4.1. Soft LVDS IP Core in Transmitter Mode 3.4.2. High-Speed I/O Timing Budget 3.4.3. Guidelines: LVDS Transmitter Channels Placement 3.4.4. Guidelines: LVDS Channels PLL Placement 3.4.5. Guidelines: LVDS Transmitter Logic Placement 3.4.6. Guidelines: Enable LVDS Pre-Emphasis for E144 Package
3.4.1. Soft LVDS IP Core in Transmitter Mode x
3.4.1.1. PLL Source Selection for Soft LVDS IP Core 3.4.1.2. Guidelines: LVDS TX Interface Using External PLL 3.4.1.3. Initializing the Soft LVDS IP Core
3.4.1.1. PLL Source Selection for Soft LVDS IP Core x
3.4.1.1.1. Instantiate Soft LVDS IP Core with Internal PLL 3.4.1.1.2. Instantiate Soft LVDS IP Core with External PLL
3.4.1.2. Guidelines: LVDS TX Interface Using External PLL x
3.4.1.2.1. ALTPLL Signal Interface with Soft LVDS Transmitter 3.4.1.2.2. Determining External PLL Clock Parameters for Soft LVDS Transmitter
3.4.2. High-Speed I/O Timing Budget x
3.4.2.1. Transmitter Channel-to-Channel Skew
3.5. LVDS Transmitter Debug and Troubleshooting x
3.5.1. Perform RTL Simulation Before Hardware Debug 3.5.2. Geometry-Based and Physics-Based I/O Rules
4. MAX® 10 LVDS Receiver Design x
4.1. High-Speed I/O Receiver Circuitry 4.2. LVDS Receiver I/O Termination Schemes 4.3. LVDS Receiver FPGA Design Implementation 4.4. LVDS Receiver Debug and Troubleshooting
4.1. High-Speed I/O Receiver Circuitry x
4.1.1. Soft Deserializer 4.1.2. Data Realignment Block (Bit Slip)
4.2. LVDS Receiver I/O Termination Schemes x
4.2.1. LVDS, 1.8 V LVDS, Mini-LVDS, and RSDS Receiver External Termination 4.2.2. SLVS Receiver External Termination 4.2.3. Sub-LVDS Receiver External Termination 4.2.4. TMDS Receiver External Termination 4.2.5. HiSpi Receiver External Termination 4.2.6. LVPECL External Termination
4.3. LVDS Receiver FPGA Design Implementation x
4.3.1. Soft LVDS IP Core in Receiver Mode 4.3.2. High-Speed I/O Timing Budget 4.3.3. Guidelines: Floating LVDS Input Pins 4.3.4. Guidelines: LVDS Receiver Channels Placement 4.3.5. Guidelines: LVDS Channels PLL Placement 4.3.6. Guidelines: LVDS Receiver Logic Placement
4.3.1. Soft LVDS IP Core in Receiver Mode x
4.3.1.1. PLL Source Selection for Soft LVDS IP Core 4.3.1.2. Guidelines: LVDS RX Interface Using External PLL 4.3.1.3. Initializing the Soft LVDS IP Core 4.3.1.4. Guidelines: Applying Input Delay Constraint for LVDS SERDES Receiver
4.3.1.1. PLL Source Selection for Soft LVDS IP Core x
4.3.1.1.1. Instantiate Soft LVDS IP Core with Internal PLL 4.3.1.1.2. Instantiate Soft LVDS IP Core with External PLL
4.3.1.2. Guidelines: LVDS RX Interface Using External PLL x
4.3.1.2.1. ALTPLL Signal Interface with Soft LVDS Receiver 4.3.1.2.2. Determining External PLL Clock Parameters for Soft LVDS Receiver
4.3.2. High-Speed I/O Timing Budget x
4.3.2.1. Receiver Input Skew Margin 4.3.2.2. Guidelines: LVDS Receiver Timing Constraints
4.3.2.1. Receiver Input Skew Margin x
4.3.2.1.1. RSKM Equation 4.3.2.1.2. Example: RSKM Calculation
4.4. LVDS Receiver Debug and Troubleshooting x
4.4.1. Perform RTL Simulation Before Hardware Debug 4.4.2. Geometry-Based and Physics-Based I/O Rules
5. MAX® 10 LVDS Transmitter and Receiver Design x
5.1. Transmitter–Receiver Interfacing 5.2. LVDS Transmitter and Receiver FPGA Design Implementation 5.3. LVDS Transmitter and Receiver Debug and Troubleshooting
5.2. LVDS Transmitter and Receiver FPGA Design Implementation x
5.2.1. LVDS Transmitter and Receiver PLL Sharing Implementation 5.2.2. Initializing the Soft LVDS IP Core
5.3. LVDS Transmitter and Receiver Debug and Troubleshooting x
5.3.1. Perform RTL Simulation Before Hardware Debug 5.3.2. Geometry-Based and Physics-Based I/O Rules
6. MAX® 10 High-Speed LVDS Board Design Considerations x
6.1. Guidelines: Improve Signal Quality 6.2. Guidelines: Control Channel-to-Channel Skew 6.3. Guidelines: Determine Board Design Constraints 6.4. Guidelines: Perform Board Level Simulations
7. Soft LVDS Intel® FPGA IP Core References x
7.1. Soft LVDS Intel® FPGA IP Parameter Settings 7.2. Soft LVDS Intel® FPGA IP Interface Signals
1. MAX® 10 High-Speed LVDS I/O Overview
2. MAX® 10 High-Speed LVDS Architecture and Features
3. MAX® 10 LVDS Transmitter Design
4. MAX® 10 LVDS Receiver Design
5. MAX® 10 LVDS Transmitter and Receiver Design
6. MAX® 10 High-Speed LVDS Board Design Considerations
7. Soft LVDS Intel® FPGA IP Core References
8. MAX® 10 High-Speed LVDS I/O User Guide Archives
9. Document Revision History for the MAX® 10 High-Speed LVDS I/O User Guide

6.2. Guidelines: Control Channel-to-Channel Skew

For the MAX® 10 devices, perform PCB trace compensation to adjust the trace length of each LVDS SERDES channel. Adjusting the trace length improves the channel-to-channel skew when interfacing with receivers.

At the package level, you must control the LVDS SERDES channel skew for each I/O bank and each side of the device. If you plan to vertically migrate from one device to another using the same board design, you must control the package migration skew for each migratable LVDS I/O pin.

For information about controlling the LVDS I/O and package skew, refer to the related information.

Related Information
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