MAX® 10 FPGA Device Overview

Download PDF
ID 683658
Date 3/10/2025
Public
Document Table of Contents
Document Table of Contents x
MAX® 10 FPGA Device Overview
MAX® 10 FPGA Device Overview x
Key Advantages of MAX® 10 Devices Summary of MAX® 10 Device Features MAX® 10 Device Ordering Information MAX® 10 Device Maximum Resources MAX® 10 Devices I/O Resources Per Package MAX® 10 Vertical Migration Support Logic Elements and Logic Array Blocks Analog-to-Digital Converter User Flash Memory Embedded Multipliers and Digital Signal Processing Support Embedded Memory Blocks Clocking and PLL FPGA General Purpose I/O External Memory Interface Configuration Power Management Revision History for the MAX® 10 FPGA Device Overview
MAX® 10 Device Ordering Information x
MAX® 10 Device Feature Options
MAX® 10 Vertical Migration Support x
MAX® 10 I/O Vertical Migration Support MAX® 10 ADC Vertical Migration Support
FPGA General Purpose I/O x
MultiVolt I/O Interface LVDS Tunneling Protocol and Interface
Configuration x
Remote System Update Hitless Update
MAX® 10 FPGA Device Overview

Summary of MAX® 10 Device Features

Table 2.   Summary of Features for MAX® 10 Devices
Feature Description
Technology 55 nm TSMC Embedded Flash (Flash + SRAM) process technology
Packaging
  • Low cost, small form factor packages—support multiple packaging technologies and pin pitches
  • Multiple device densities with compatible package footprints for seamless migration between different device densities
  • RoHS6-compliant
Core architecture
  • 4-input look-up table (LUT) and single register logic element (LE)
  • LEs arranged in logic array block (LAB)
  • Embedded RAM and user flash memory
  • Clocks and PLLs
  • Embedded multiplier blocks
  • General purpose I/Os
Internal memory blocks
  • M9K—9 kilobits (Kb) memory blocks
  • Cascadable blocks to create RAM, dual port, and FIFO functions
User flash memory (UFM)
  • User accessible non-volatile storage
  • High speed operating frequency
  • Large memory size
  • High data retention
  • Multiple interface option
Embedded multiplier blocks
  • One 18 × 18 or two 9 × 9 multiplier modes
  • Cascadable blocks enabling creation of filters, arithmetic functions, and image processing pipelines
ADC
  • 12-bit successive approximation register (SAR) type
  • Up to 17 analog inputs
  • Cumulative speed up to 1 million samples per second ( MSPS)
  • Integrated temperature sensing capability
Clock networks
  • Global clocks support
  • High speed frequency in clock network
Internal oscillator Built-in internal ring oscillator
PLLs
  • Analog-based
  • Low jitter
  • High precision clock synthesis
  • Clock delay compensation
  • Zero delay buffering
  • Multiple output taps
General-purpose I/Os (GPIOs)
  • Multiple I/O standards support
  • On-chip termination (OCT)
  • Up to 720 megabits per second (Mbps) LVDS receiver and transmitter
External memory interface (EMIF) 1 Supports up to 600 Mbps external memory interfaces:
  • DDR3, DDR3L, DDR2, LPDDR2 (on 10M16, 10M25, 10M40, and 10M50.)
  • SRAM (Hardware support only)
Note: For 600 Mbps performance, –6 device speed grade is required. Performance varies according to device grade (commercial, industrial, or automotive) and device speed grade (–6 or –7). Refer to the MAX® 10 FPGA Device Datasheet or External Memory Interface Spec Estimator for more details.
Configuration
  • Internal configuration
  • JTAG
  • Advanced Encryption Standard (AES) 128-bit encryption and compression options
  • Flash memory data retention of 20 years at 85 °C
Flexible power supply schemes
  • Single- and dual-supply device options
  • Dynamically controlled input buffer power down
  • Sleep mode for dynamic power reduction
Related Information
1 EMIF is only supported in selected MAX® 10 device density and package combinations. Refer to the MAX® 10 External Memory Interface User Guide for more information.
Level Two Title