MAX® 10 FPGA Device Overview

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ID 683658
Date 3/10/2025
Public
Document Table of Contents
Document Table of Contents x
MAX® 10 FPGA Device Overview
MAX® 10 FPGA Device Overview x
Key Advantages of MAX® 10 Devices Summary of MAX® 10 Device Features MAX® 10 Device Ordering Information MAX® 10 Device Maximum Resources MAX® 10 Devices I/O Resources Per Package MAX® 10 Vertical Migration Support Logic Elements and Logic Array Blocks Analog-to-Digital Converter User Flash Memory Embedded Multipliers and Digital Signal Processing Support Embedded Memory Blocks Clocking and PLL FPGA General Purpose I/O External Memory Interface Configuration Power Management Revision History for the MAX® 10 FPGA Device Overview
MAX® 10 Device Ordering Information x
MAX® 10 Device Feature Options
MAX® 10 Vertical Migration Support x
MAX® 10 I/O Vertical Migration Support MAX® 10 ADC Vertical Migration Support
FPGA General Purpose I/O x
MultiVolt I/O Interface LVDS Tunneling Protocol and Interface
Configuration x
Remote System Update Hitless Update
MAX® 10 FPGA Device Overview

MAX® 10 Devices I/O Resources Per Package

Table 5.  Package Plan for MAX® 10 Single Power Supply Devices
Device Package
Type

V81

81-pin WLCSP

Y180

180-pin WLCSP

M153

153-pin MBGA

U169

169-pin UBGA

U324

324-pin UBGA

B610

610-pin VPBGA 3

E144

144-pin EQFP

Size 4 mm × 4 mm 6 mm × 5 mm 8 mm × 8 mm 11 mm × 11 mm 15 mm × 15 mm 19 mm × 19 mm 22 mm × 22 mm
Ball Pitch 0.4 mm 0.35 mm 0.5 mm 0.8 mm 0.8 mm Variable 4 0.5 mm
10M02 — — 112 130 246 — 101
10M04 — — 112 130 246 — 101
10M08 58 — 112 130 246 — 101
10M16 — 125 — 130 246 — 101
10M25 — — — — — — 101
10M40 — — — — — 485 101
10M50 — — — — — 485 101
Table 6.  Package Plan for MAX® 10 Dual Power Supply Devices
Device Package
Type

V36

36-pin WLCSP

5

V81

81-pin WLCSP

5

U324

324-pin UBGA

F256

256-pin FBGA

B610

610-pin VPBGA3

F484

484-pin FBGA

F672

672-pin FBGA

Size 3 mm × 3 mm 4 mm × 4 mm 15 mm × 15 mm 17 mm × 17 mm 19 mm × 19 mm 23 mm × 23 mm 27 mm × 27 mm
Ball Pitch 0.4 mm 0.4 mm 0.8 mm 1.0 mm Variable4 1.0 mm 1.0 mm
10M02 27 — 160 — — — —
10M04 — — 246 178 — — —
10M08 — 56 246 178 — 250 —
10M16 — — 246 178 — 320 —
10M25 — — — 178 — 360 —
10M40 — — — 178 485 360 500
10M50 — — — 178 485 360 500
Related Information
3 I/O placement restriction applies. For more information, refer to the MAX® 10 FPGA Signal Integrity Design Guidelines .
4 The Variable Pitch BGA (VPBGA) packaging is compatible with Type III PCBs that use the design rules equivalent to 0.8 mm ball pitch and standard plated through hole (PTH) vias. The VPBGA ball pitch is variable and it helps to ease signal routing. For more information, refer to the MAX® 10 FPGA Signal Integrity Design Guidelines .
5 For the performance specifications of the V36 and V81 packages of MAX® 10 dual power supply devices, follow the data sheet specifications for single supply devices.
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