AN 672: Transceiver Link Design Guidelines for High-Gbps Data Rate Transmission

ID 683624
Date 1/29/2020

1.4.4. References

  • Base Materials for High Speed, High Frequency PC Boards, Rick Hartley, PCB&A, Mar 2002
  • High-Speed Digital Design, Handbook of Black Magic, Howard Johnson & Martin Graham, Professional Technical Reference, Upper Saddle River, NJ 07458, 1993
  • Signal Integrity – Simplified, Dr. Eric Bogatin, Prentice Hall Professional Technical Reference, Upper Saddle River, NJ 07458, Dec 2006
  • A Survey and Tutorial of Dielectric Materials Used In the Manufacture of Printed Circuit Boards, Lee W. Ritchey, Speeding Edge, Circuitree Magazine, Nov 1999
  • High-Speed Digital Systems Design, A Handbook of Interconnect Theory and Design Practices. Stephen W. Hall, Garrett W. Hall, James A. McCall, New York, John Wiley & Sons, Inc., 2000
  • Discussions on Non Functional Pad Removal / Backdrilling and PCB Reliability, Bill Birch, PWB Interconnect Solutions Inc., 103-235 Stafford Road West, Nepean, Ontario, Canada
  • A Practical Method for Modeling PCB Transmission Lines with Conductor Surface Roughness and Wideband Dielectric Properties, Tao Liang, Stephen Hall, Howard Heck & Gary Brist
  • Non-Classical Conductor Losses Due to copper Foil Roughness and Treatment, Gary Brist, Stephen Hall, Sidney Clouser, & Tao Liang
  • CEI-25G-LR and CEI-28G-VSR Multi-Vendor Interoperability Testing White Paper, Optical Internetworking Forum, March 2012