AN 114: Board Design Guidelines for Intel Programmable Device Packages

ID 683481
Date 5/27/2022
Public
Document Table of Contents

1.2.5.2. Solder Mask Defined Pad

In an SMD pad, the solder mask overlaps the surface land pad’s copper surface. Refer to Figure 3 for the Side View of NSMD and SMD Land Pads. This overlap provides greater adhesion strength between the copper pad and the PCB’s epoxy/glass laminate, which can be important under extreme bending and during accelerated thermal cycling tests. However, the solder mask overlap reduces the amount of copper surface available for the BGA solder ball.

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