AN 114: Board Design Guidelines for Intel Programmable Device Packages

ID 683481
Date 5/27/2022
Document Table of Contents

1.3. PCB Layout for High-Density BGA Packages

When designing a PCB for high-density BGA packages, consider the following factors:

  • Surface land pad dimension
  • Via capture pad layout and dimension
  • Signal-line space and trace width
  • Number of PCB layers
Note: Controlling dimension is calculated in millimeters for all high-density BGA figures.

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